Conference Proceeding

Application of Thin-Film RCLG Model for the Modeling of Inkjet Printed Microstrip Lines

Tampere Univ. of Technol., Tampere
06/2008; DOI:10.1109/SPI.2008.4558369 ISBN: 978-1-4244-2317-0 pp.1 - 4 In proceeding of: Signal Propagation on Interconnects, 2008. SPI 2008. 12th IEEE Workshop on
Source: IEEE Xplore

ABSTRACT Conductor thickness arising from printable electronics manufacturing technology is typically of the order of a skin depth in the frequency range from the upper UHF band to the lower SHF band. Modeling these conductors using standard circuit models however yield inaccurate results whereas full-wave modeling is very time consuming. In this paper, a circuit simulation model based on the surface resistance of a thin penetrable conductor is presented. The proposed model is validated by comparison with full-wave simulation results, Comparison with a conventional circuit-simulation model shows improved accuracy in the loss calculation.

0 0
 · 
0 Bookmarks
 · 
62 Views

Full-text

View
1 Download
Available from

Keywords

circuit simulation model
 
Conductor thickness
 
conventional circuit-simulation model
 
frequency range
 
full-wave modeling
 
full-wave simulation results
 
loss calculation
 
lower SHF band
 
printable electronics manufacturing technology
 
proposed model
 
standard circuit models
 
thin penetrable conductor