Article

Materials and Mechanics for Stretchable Electronics

Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, 1304 West Green Street, Urbana, IL 61801, USA.
Science (Impact Factor: 31.48). 03/2010; 327(5973):1603-7. DOI: 10.1126/science.1182383
Source: PubMed

ABSTRACT Recent advances in mechanics and materials provide routes to integrated circuits that can offer the electrical properties of conventional, rigid wafer-based technologies but with the ability to be stretched, compressed, twisted, bent, and deformed into arbitrary shapes. Inorganic and organic electronic materials in microstructured and nanostructured forms, intimately integrated with elastomeric substrates, offer particularly attractive characteristics, with realistic pathways to sophisticated embodiments. Here, we review these strategies and describe applications of them in systems ranging from electronic eyeball cameras to deformable light-emitting displays. We conclude with some perspectives on routes to commercialization, new device opportunities, and remaining challenges for research.

9 Followers
 · 
279 Views
  • Source
    [Show abstract] [Hide abstract]
    ABSTRACT: We propose a numerical framework to study surface wrinkling of stiff thin films on soft substrates: from 2D to 3D modeling, from classical to multi-scale perspective. The main objective is to apply advanced numerical methods (path-following techniques, bifurcation indicators, bridging techniques, multi-scale analyses, etc.) for multiple-bifurcation analyses of film-substrate buckling problems. Through incorporating these numerical methods with FEM, it can predict the occurrence and post-bifurcation evolution of wrinkling patterns in various boundary and loading conditions as well as complex geometries.
    12ème Colloque National en Calcul des Structures (CSMA 2015), Giens, Var, France; 05/2015
  • Source
    Journal of Applied Mechanics 05/2015; 82(5). DOI:10.1115/1.4030010 · 1.40 Impact Factor
  • Source
    [Show abstract] [Hide abstract]
    ABSTRACT: The reliable picking-up of thin chip using the vacuum sorption determines the success rate of flip chip assemblies from donor tape to receptor substrate. An analytical solution to model the chip–adhesive–tape structure with vacuum loads is introduced to understand the fracture mechanism of chip picking-up. The critical process parameters (the length of bonded region, vacuum strength, and pick-up displacement, etc.) are investigated. Theoretical predictions are used in combination with virtual crack-closure-based finite-element technique to reveal the detaching behavior between the chip and the adhesive tape. The results show that the length of the bonded region should be controlled less than 40% of chip length to eliminate the effects of chip thickness, and the higher vacuum strength acting on the adhesive tape is able to accelerate the detachment of the chip from the adhesive tape. In particular, a process window is proposed to enhance the reliability and efficiency of picking-up for a thin chip.
    Journal of Adhesion Science and Technology 03/2015; DOI:10.1080/01694243.2015.1026869 · 1.09 Impact Factor

Preview

Download
26 Downloads
Available from