Materials and Mechanics for Stretchable Electronics

Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, 1304 West Green Street, Urbana, IL 61801, USA.
Science (Impact Factor: 33.61). 03/2010; 327(5973):1603-7. DOI: 10.1126/science.1182383
Source: PubMed


Recent advances in mechanics and materials provide routes to integrated circuits that can offer the electrical properties
of conventional, rigid wafer-based technologies but with the ability to be stretched, compressed, twisted, bent, and deformed
into arbitrary shapes. Inorganic and organic electronic materials in microstructured and nanostructured forms, intimately
integrated with elastomeric substrates, offer particularly attractive characteristics, with realistic pathways to sophisticated
embodiments. Here, we review these strategies and describe applications of them in systems ranging from electronic eyeball
cameras to deformable light-emitting displays. We conclude with some perspectives on routes to commercialization, new device
opportunities, and remaining challenges for research.

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    • "Recently, a serpentine structure of GNRs is chemically synthesized and the width can be down to ~1 nm with atomically smooth edges [24]. Based on the similarity in geometry with the design of stretchable devices at the microscale [25] [26], this serpentine structure may sustain a large tensile strain while not arousing an obvious increase of strain/stress in comparison with "

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    • "The whole system is embedded into a stretchable rubber to keep everything together and to protect the device. An advantage of this technology over competing stretchable electronics technologies [10] is that it uses standard flex foil manufacturing technologies. The process starts from a normal full area flex foil (polyester, polyimide or other plastic foil materials). "
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    ABSTRACT: Measuring the quality of human health and well-being is one of the key growth areas in our society. Preferably, these measurements are done as unobtrusive as possible. These sensoric devices are then to be integrated directly on the human body as a patch or integrated into garments. This requires the devices to be very thin, flexible and sometimes even stretchable. An overview of recent technology developments in this domain and concrete application examples will be discussed.
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    • "In nature, surface morphological instabilities of a stiff thin layer attached on a soft substrate have been widely observed such as wrinkles of hornbeam leaf and human skin, and these phenomena have raised considerable research interests over the last decade (Efimenko et al., 2005; Mahadevan and Rica, 2005; Stoop et al., 2015). In modern industry, surface wrinkles can be widely applied in large area ranging from the micro/nano-fabrication of flexible electronic devices with controlled morphological patterns (Bowden et al., 1998; Rogers et al., 2010), the design of coated materials or living tissues (Brau et al., 2011), to the mechanical property measurement of material characteristics (Howarter and Stafford, 2010). Several theoretical, numerical and experimental works have been devoted to stability analyses in order to determine the critical conditions of instability and the corresponding wrinkling patterns (Audoly and Boudaoud, 2008a,b,c; Chen and Hutchinson, 2004; Huang and Im, 2006; Huang et al., 2005; Song et al., 2008). "
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    ABSTRACT: Spatial pattern formation in stiff thin films on soft substrates is investigated from a multi-scale point of view based on a technique of slowly varying Fourier coefficients. A general macroscopic modeling framework is developed and then a simplified macroscopic model is derived. The model incorporates Asymptotic Numerical Method (ANM) as a robust path-following technique to trace the post-buckling evolution path and to predict secondary bifurcations. The proposed multi-scale finite element framework allows sinusoidal and square checkerboard patterns as well as their bifurcation portraits to be described from a quantitative standpoint. Moreover, it provides an efficient way to compute large-scale instability problems with a significant reduction of computational cost compared to full models.
    Journal of the Mechanics and Physics of Solids 10/2015; 86:150-172. DOI:10.1016/j.jmps.2015.10.003 · 3.60 Impact Factor
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