Full Copper Electrochemical Mechanical Planarization (Ecmp) as a Technology Enabler for the 45 and 32nm Nodes
DOI: 10.1109/IITC.2007.382352 Conference: International Interconnect Technology Conference, IEEE 2007
Source: IEEE Xplore
ABSTRACT In this work, we demonstrate the capability of Ecmp to meet the 45 nm and 32 nm technology node requirements in terms of topography behavior, the related electrical spread, lithography DOF budget and ULK compatibility.
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