Conference Paper
Optimization of microchannel heat sinks using entropy generation minimization method
Dept. of Mech. Eng., Waterloo Univ., Ont.
DOI: 10.1109/STHERM.2006.1625210 Conference: Semiconductor Thermal Measurement and Management Symposium, 2006 IEEE TwentySecond Annual IEEE Source: IEEE Xplore

Article: SurrogateBased Analysis and Optimization for the Design of Heat Sinks With Jet Impingement
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ABSTRACT: Heat sinks are widely used for cooling electronic devices and systems. Their thermal performance is usually determined by the material, shape, and size of the heat sink. With the assistance of computational fluid dynamics (CFD) and surrogatebased optimization, heat sinks can be designed and optimized to achieve a high level of performance. In this paper, the design and optimization of a platefintype heat sink cooled by impingement jet is presented. The flow and thermal fields are simulated using the CFD simulation; the thermal resistance of the heat sink is then estimated. A Kriging surrogate model is developed to approximate the objective function (thermal resistance) as a function of design variables. Surrogatebased optimization is implemented by adaptively adding infill points based on an integrated strategy of the minimum value, the maximum mean square error approach, and the expected improvement approaches. The results show the influence of design variables on the thermal resistance and give the optimal heat sink with lowest thermal resistance for given jet impingement conditions.IEEE Transactions on Components, Packaging, and Manufacturing Technology 03/2014; 4(3):429437. · 1.26 Impact Factor  [Show abstract] [Hide abstract]
ABSTRACT: The heat sinks are utilized in electronic devices to eliminate heat from the chip and efficiently transmit it to the environment. Therefore, the optimal geometry sizes of fin heat sinks are the point of concern for manufacturers and designers. For this reason, the importance of optimization techniques particularly metaheuristics is understood. The design variables are width of heat sink, number of fins, fin height, and fin diameter. The various responses that have been considered are electromagnetic emitted radiations, thermal resistance, and mass of the heat sink investigated separately and simultaneously (multiobjective). Mine blast algorithm (MBA), as a recently developed optimizer, is inspired from explosion of mines. The optimum dimensions and values for each response have been obtained by the MBA and have been compared with other optimization methods in the literature. In terms of thermal resistance and mass responses, the MBA has offered better values, while for the emitted radiations, the obtained results obtained by Taguchibased gray relational analysis (TGRA) was preferred. For manufacturing point of view, the MBA and TGRA both suggested better and efficient design. In addition, the value path analysis has been carried out to compare the tradeoff among the considered responses. Finally, parametric sensitivity analyses have been implemented for design parameters, and discussions and comparisons have been carried out for the effects of each decision variable. By considering all responses, width of heat sink and fin height are considered as the most important and effective design parameters, respectively.05/2014;  [Show abstract] [Hide abstract]
ABSTRACT: The optimization of a nanofluidcooled rectangular microchannel heat sink is reported. Two nanofluids with volume fraction of 1 %, 3 %, 5 %, 7 % and 9 % are employed to enhance the overall performance of the system. An optimization scheme is applied consisting of a systematic thermal resistance model as an analysis method and the elitist nondominated sorting genetic algorithm (NSGAII). The optimized results showed that the increase in the particles volume fraction results in a decrease in the total thermal resistance and an increase in the pumping power. For volume fractions of 1 %, 3 %, 5 %, 7 % and 9 %, the thermal resistances were 0.072, 0.07151, 0.07075, 0.07024 and 0.070 [oK W1] for the SiCH2O while, they were 0.0705, 0.0697, 0.0694, 0.0692 and 0.069 [oK W1] for the TiO2H2O. The associated pumping power were 0.633, 0.638, 0.704, 0.757 and 0.807 [W] for the SiCH2O while they were 0.645, 0.675, 0.724, 0.755 and 0.798 [W] for the TiO2H2O. In addition, for the same operating conditions, the nanofluidcooled system outperformed the watercooled system in terms of the total thermal resistance (0.069 and 0.11 for nanofluidcooled and watercooled systems, respectively). Based on the results observed in this study, nanofluids should be considered as the future coolant for electronic devices cooling systems.Thermal Science 01/2013; · 0.84 Impact Factor
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