Conference Proceeding
Determination of the acceleration factor between wafer level and package level electromigration test
02/2005;
DOI:10.1109/RELPHY.2005.1493191
ISBN: 0-7803-8803-8 pp.658 - 659 In proceeding of: Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
Source: IEEE Xplore
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