Conference Proceeding
Development of specifications for a thermal buffer device
Northumbria Univ., UK
10/2004;
ISBN: 1-86043-365-0 pp.1171 - 1175 vol. 2 In proceeding of: Universities Power Engineering Conference, 2004. UPEC 2004. 39th International, Volume: 3
Source: IEEE Xplore
-
Citations (0)
-
Cited In (0)
Data provided are for informational purposes only. Although carefully collected, accuracy cannot be guaranteed.
The impact factor represents a rough estimation of the journal's impact factor and does not reflect the actual
current impact factor.
Publisher conditions are provided by RoMEO. Differing provisions from the publisher's actual policy or licence
agreement may be applicable.
Keywords
appropriate phase change material
conventional heat sinks
effective dissipation
extended time
finite element analysis package
heat transfer rate
hybrid fault current
interrupting device
mechanical damage
metal oxide varistors
non-linear transient
required inputs
short thermal path
thermal buffer
thermal buffer capacity
thermal effects
thermal runaway
thermomechanical analysis
transient thermal dissipation demand
typical model