System design issues for 3D system-in-package (SiP)
ABSTRACT Development in electronics is driven by device and market needs. This paper focuses on system design issues for three-dimensional packaging technology and discusses interconnection density, material compatibility, thermal management, electrical requirements, related to delay and noise. Microelectronics packaging has to provide all future devices, such as electronics, actuators, sensors, antennas, optical/photonic, MEMS, and biological solutions. However, a 3D package is a cost effective solution to save placement and routing area on board using several IC processes in the same module. System-in-package (SiP) can combine all the electronic requirements of a functional system or a subsystem in one package. The driving force is integration without compromising individual chip technologies. In this work, a stacked system-in-package structure has been studied. The thermo-mechanical behavior of packages has been analyzed by finite element analysis (FEA) and the correlation between the experimental test results and the modeling was analyzed. A stacked 3D package can contain multiple heat sources that produce high power density. Therefore, thermal management needs extra attention to ensure safe operating temperatures under all conditions. The thermal behavior of the package was modeled using FEA and a boundary condition independent (BCI) compact thermal model (CTM) was built based on simulation results. In addition, high-speed signal and interfering environment set quite stringent requirements for 3D devices. Crosstalk between vertical connections was simulated and measured. Measurements of S-parameters were done using a network analyzer. The frequency range was 45 MHz to 20 GHz.
- Electronic Components and Technology Conference, 2006. Proceedings. 56th; 01/2008
Conference Paper: Design aspects of 3D integration of MEMS-based systems[Show abstract] [Hide abstract]
ABSTRACT: Due to high integration density the influence of manufacturing technologies on the system behavior has to be considered in the design process of 3D systems. Therefore, information from different physical domains has to be provided to designers. The variety of structures and physical effects requires efficient modeling approaches and simulation algorithms. In the following a modular approach which covers detailed analysis with PDE solvers and more abstract behavioral modeling is described.Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on; 05/2009
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ABSTRACT: Micro/nanosystems have attracted considerable interests and seen significant advances over the years. The huge gap between technology development and commercialization can be largely attributed to the challenges faced in the integration and packaging of the devices. The packaging has to work around the diverse functional requirements while ensuring that the device is able to perform effectively and reliably at the prescribed operating environments. The trend to make products lighter, smaller and thinner is relentless; heavy emphasis is placed on user-friendliness, functionality, durability and price competitiveness. Wafer bonding is recognized to be a key technology for three dimensional (3D) integration and packaging; particularly for micro/nanosystems that require vacuum packaging and hermetic sealing. The bonding process can be applied to a wide range of materials, including silicon, III–V semiconductor compounds, glass and ceramics. Low temperature bonding offers crucial advantages in multifunctional systems packaging such as system in packages (SIP). Low temperature bonding, through-via interconnection, metal-to-metal joining, alignment and hermeticity are a set of process challenges that have to be collectively overcome before we are likely to see pervasive applications of micro/nanosystems.01/2005;