Conference Paper

Prediction and verification of power/ground plane edge radiation excited by through-hole signal via based on balanced TLM and via coupling model

Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
DOI: 10.1109/EPEP.2003.1250027 Conference: Electrical Performance of Electronic Packaging, 2003
Source: IEEE Xplore


We introduce a modeling and simulation method to predict power/ground plane resonance and edge radiation coupled from the broken return current path of a through-hole signal via, and analyze the coupling and radiation mechanism. The approach is successfully verified with a series of measurements with various plane conditions.

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    • "To simulate and analyze the SSN generation and coupling mechanism through the signal via transition, we have used a via coupling model combined with a balanced TLM model [16] [17] [18] [19]. The via coupling model is shown in Fig. 3 for the Type-4 layer structure. "
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    ABSTRACT: The signal via is a heavily utilized interconnection structure in high-density system-on-package (SoP) substrates and PCBs. Vias facilitate complicated routings in these multilayer structures. Significant simultaneous switching noise (SSN) coupling occurs through the signal via transition when the signal via suffers return current interruption caused by reference plane exchange. The coupled SSN decreases noise and timing margins of digital and analog circuits, resulting in reduction of achievable jitter performance, bit error ratio (BER) and system reliability. We introduce a modeling method to estimate SSN coupling based on a balanced transmission line matrix (TLM) method. The proposed modeling method is successfully verified by the frequency domain measurements of several via transition structures
    Electromagnetic Compatibility, 2006. EMC-Zurich 2006. 17th International Zurich Symposium on; 01/2006
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    • "The model for the on-die power/ground bus introduces the balanced TLM method. [5][6][7] Conventional on-die power/ground network has a mesh structure as shown in Figure 2. (a). Each parameter value is defined for one cell, from electrical and physical information depending on the conditions such as the sheet resistance, metal thickness, pitch, and stackup . "
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    ABSTRACT: The modeling and simulation results about the IC and package power/ground network have been depicted. With the modeling for broadband frequency region, the effect of each part in power/ground network on IC and package was analyzed in frequency domain.
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    • "When excited at the resonance frequency, the planes become a significant source of noise in the package and the board and also act as a source of edge radiated field emission. The standing waves in the cavity at resonance can produce significant coupling to neighboring circuits and transmission lines [13]. Fig. 7 depicts the voltage distribution of simultaneous switching noise on the power and ground planes for an open-ended board of size . "
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    ABSTRACT: The power consumption of microprocessors is increasing at an alarming rate leading to 2X reduction in the power distribution impedance for every product generation. In the last decade, high I/O ball grid array (BGA) packages have replaced quad flat pack (QFP) packages for lowering the inductance. Similarly, multilayered printed circuit boards loaded with decoupling capacitors are being used to meet the target impedance. With the trend toward system-on-package (SOP) architectures, the power distribution needs can only increase, further reducing the target impedance and increasing the isolation characteristics required. This paper provides an overview on the design of power distribution networks for digital and mixed-signal systems with emphasis on design tools, decoupling, measurements, and emerging technologies.
    IEEE Transactions on Advanced Packaging 06/2004; 27(2-27):286 - 300. DOI:10.1109/TADVP.2004.831897 · 1.28 Impact Factor
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