Conference Paper

Reduced temperature flip-chip technologies on flexible display substrates using adhesives

Imec/Intec/TFCG, Gent, Belgium
DOI: 10.1109/POLYTR.2002.1020189 In proceeding of: Polymers and Adhesives in Microelectronics and Photonics, 2002. POLYTRONIC 2002. 2nd International IEEE Conference on
Source: IEEE Xplore

ABSTRACT The paper investigates the possibilities to flip-chip assemble Si driver chips onto a flexible display, which is to be integrated in a smart card. The chips are Au or Ni/Au bumped, the substrate material consists of PES (polyether sulphone) with conductive ITO pads. One technology, using ICA and NCA seems to be quite straightforward, another, using ACA, reveals the problem of ITO damage during thermocompression.

0 Bookmarks
 · 
40 Views
  • [Show abstract] [Hide abstract]
    ABSTRACT: Anisotropic conductive adhesive (ACA) technology is one of the most important technologies for interconnect of electronics hardware. During the last 20 years, tremendous research and development effort has been spent on this. The purpose of this paper is to present ontology of the publications within the ACA technology since 1980. The following search fields are used for this study: ACA/ACF on glass, flexible circuits (polyester or polyimide), rigid board (FR-4), ceramic substrate, flexible circuitry interconnect to rigid, ACA/ACF on smart card applications, ACF/ACA on organic display, reliability, stress, process optimization and environmental issues. The search sources that were used are: IEEE Transactions on Components, Packaging, and Manufacturing Technology, Inspec, Electronic Components and Technology Conference series proceedings, Journal of Electronics Packaging, Soldering and Surface Mount Technology and Circuit World. Over 150 papers have been found covering the above mentioned topics. The paper presents a list of the publications and abstracts of the searched results along with some comments about the importance of the paper in the topic. The purpose is simply to pinpoint the most important papers that have played significant role for the advancement of the ACA technology.
    Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on; 04/2005
  • [Show abstract] [Hide abstract]
    ABSTRACT: Anisotropic conductive adhesive (ACA) technology is one of the most important technologies for interconnect of electronics hardware. During the last 20 years, tremendous research and development effort has been spent on this. The purpose of this paper is to present ontology of the publications within the ACA technology since 1980. The following search fields are used for this study: ACA/ACF on glass, flexible circuits (polyester or polyimide), rigid board (FR-4), ceramic substrate, flexible circuitry interconnect to rigid, ACA/ACF on smart card applications, ACF/ACA on organic display, reliability, stress, process optimization and modeling study of ACA. The search sources that were used include: IEEE Transactions on Components, Packaging, and Manufacturing Technology, Inspec, Electronic Components and Technology Conference series proceedings, Journal of Electronics Packaging, Soldering and surface mount technology and circuit world. The paper presents a list of the publications and abstracts of the searched results along with some comments about the importance of the paper in the topic. The purpose is simply to pinpoint the most important papers that have played significant role for the advancement of the ACA technology
    High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on; 07/2005
  • [Show abstract] [Hide abstract]
    ABSTRACT: This paper is intended to provide an initial resource for researchers and practitioners entering the isotropic conductive adhesive (ICA) field, but may also prove useful to those with prior experience. It presents an historical overview of the issues confronted in ICA development and use in various electronics packaging applications in place of soldering technology.
    Polymers and Adhesives in Microelectronics and Photonics, Polytronic, 2005. Polytronic 2005. 5th International Conference on; 11/2005