Conference Proceeding

Reduced temperature flip-chip technologies on flexible display substrates using adhesives

Imec/Intec/TFCG, Gent, Belgium
02/2002; DOI:10.1109/POLYTR.2002.1020189 ISBN: 0-7803-7567-X In proceeding of: Polymers and Adhesives in Microelectronics and Photonics, 2002. POLYTRONIC 2002. 2nd International IEEE Conference on
Source: IEEE Xplore

ABSTRACT The paper investigates the possibilities to flip-chip assemble Si driver chips onto a flexible display, which is to be integrated in a smart card. The chips are Au or Ni/Au bumped, the substrate material consists of PES (polyether sulphone) with conductive ITO pads. One technology, using ICA and NCA seems to be quite straightforward, another, using ACA, reveals the problem of ITO damage during thermocompression.

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