The design of a high efficiency circularly polarized nearly square
patch antenna at L-band is presented. One way to improve the efficiency
of the inherently low efficiency microstrip antennas is to use
substrates with a low permittivity. A low permittivity substrate with
εr=1.1028 was obtained by using a combination of Rogers
RT/Duroid 5880 and Rohacell hard foam. The effect of a 5 mils thick
Rogers RT/Duroid 5880 superstrate on the efficiency was also studied.
Results of the antenna efficiency and bandwidth for both the low
dielectric substrate and superstrate are presented. The results were
obtained using the 1E3D software package and compared with measured
results. Efficiencies of the order of 85% for a single patch element
"The detailed characteristics of various cavity backed antennas are summarized in . Another approach to improve the bandwidth and efficiency of the conventional patch antenna is to minimize the substrate dielectric constant, as demonstrated in  . It is also known that the antenna gain can be considerably increased by covering the antenna with a high permittivity superstrate  . "
[Show abstract][Hide abstract] ABSTRACT: This paper presents the design of a fully packaged 60 GHz wideband patch antenna incorporating an air cavity and a fused silica superstrate. Circular polarization (CP) is realized by introducing a diagonal slot at the center of the square patch. By optimizing the patch and the slot dimensions, a high efficiency (>90%) microstrip fed CP antenna with an impedance bandwidth of 24% and a 6 dB axial ratio bandwidth of 21.5% is designed. A coplanar waveguide (CPW) to microstrip transition with λ/4-open-ended stubs are then designed to match the antenna to the CPW packaging interface. The experimental results of the final packaged antenna agree reasonably with the simulation results, demonstrating an impedance bandwidth of more than 26% and a 6 dB axial ratio bandwidth of 22.7%.
Wireless Engineering and Technology 07/2012; 3:97. DOI:10.4236/wet.2012.33016
"Moreover, the ratio of the total power dissipated by the antenna to the net power accepted by the antenna at its terminals during the radiation process (radiation efficiency) is around 88%. These high values are in line with good efficiencies characterizing microstrip antennas  "
[Show abstract][Hide abstract] ABSTRACT: A novel circularly polarized microstrip antenna using triple proximity-fed method is proposed in this paper. The circular polarization radiation is produced by adjusting 120◦ phase shift between the feeds. In the feeding network, a three-way circular-sector power divider is adopted to distribute the current equally to each feed. A method of moments is employed for optimizing the design and achieving a good circular polarization at the center frequency of 1.28 GHz. The measured result shows that 3-dB axial ratio bandwidth and maximum gain are about 0.68% (8.7 MHz) and 7.11 dBic, respectively, which are consistent with the simulated values of 0.70% (9.0 MHz) and 7.21 dBic. The narrow bandwidth and reasonable gain indicate that this antenna is promising for various applications in L-band.
AEU - International Journal of Electronics and Communications 05/2012; 66(5):395-400. DOI:10.1016/j.aeue.2011.09.008 · 0.60 Impact Factor
"Simulated and measured antenna gain. suspending the antenna in air , or adding a superstrate over a planar antenna –. The antenna used in this paper combines a metal cavity with a suspended folded dipole antenna  to provide a mechanically stable and reliable solution for high-volume manufacturing. "
[Show abstract][Hide abstract] ABSTRACT: In this paper, we present a cost-effective chip-scale packaging solution for a 60-GHz industrial-scientific-medical band receiver (Rx) and transmitter (Tx) chipset capable of gigabit-per-second wireless communications. Envisioned applications of the packaged chipset include 1-3-Gb/s directional links using amplitude shift-keying or phase shift-keying modulation and 500-Mb/s-1-Gb/s omni-directional links using orthogonal frequency-division multiplexing modulation. This paper demonstrates the first fully package-integrated 60-GHz chipset including receive and transmit antennas in a cost-effective plastic package. A direct-chip-attach (DCA) and surface mountable land-grid-array (LGA) package technology is presented. The size of the DCA package is 7times11 mm<sup>2</sup> and the LGA package size is 6times13 mm<sup>2</sup>. Optionally, the Tx and Rx chip can be packaged together with Tx and Rx antennas in a combined 13times13 mm<sup>2</sup> LGA transceiver package
IEEE Transactions on Microwave Theory and Techniques 09/2006; 54(8-54):3387 - 3397. DOI:10.1109/TMTT.2006.877832 · 2.24 Impact Factor
Data provided are for informational purposes only. Although carefully collected, accuracy cannot be guaranteed. The impact factor represents a rough estimation of the journal's impact factor and does not reflect the actual current impact factor. Publisher conditions are provided by RoMEO. Differing provisions from the publisher's actual policy or licence agreement may be applicable.