Article

S-parameters characterization of through, blind, and buried via holes

Dept. of Electr. Eng., L'Aquila Univ., Italy
IEEE Transactions on Mobile Computing (Impact Factor: 2.91). 05/2003; 2(2):174- 184. DOI: 10.1109/TMC.2003.1217237
Source: DBLP

ABSTRACT A method for de-embedding the scattering parameters matrix for single-end or differential through, buried, and blind via holes in multilayer printed circuit boards for high-speed digital applications is presented. The proposed technique starts from a measurement or simulation of the structure containing the discontinuity and, after the structure's partitioning, extracts the scattering parameters of the required discontinuity. The procedure is applied to different kinds of single-ended and differential via holes and is validated by measurements. The finite integration technique is used to perform the needed three-dimensional electromagnetic simulations. Due to its reduced CPU time, the proposed methodology is suitable for a parametric analysis on the electrical performance of the via hole discontinuities and it gives useful results for the extraction of accurate computer-aided design models.

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    • "There have been many techniques to characterize and model vias [14] [15] [16] [17] [18] [19] [20] [21] [22] [23], however, most of them are based on numerical calculation [14] [15] [16], commercial field solvers [17] [18], or simple closed form models [19] [20]. There are relatively few experimental characterization techniques [21] [22] [23]. In practice, it is inherently difficult to accurately characterize a small via because of parasitics. "
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    • "The relevant dimensions and geometry are shown in Fig. 1. The deembedding process applied in [2] is as follows: the first step is to obtain the scattering matrix S tot (bold letters refer to matrices or vectors) between the terminals ports 1 and 2 of the complete structure. Then, the structure is partitioned in three ____________2005 Conference on Information Sciences and Systems, The Johns Hopkins University, March 16--18, 2005 substructures assumed electro-magnetically decoupled among each other. "
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    ABSTRACT: This paper presents an overview of different de-embedding techniques, compares the advantages and disadvantages of these techniques, and applies two of the methods to a via-trace-via assembly. The measured S-parameter and Fourier Transform based methods were used to de-embed probe characteristics from the via-trace-via assembly. Probes de-embedding results from these methods are similar, however, the Fourier transform produces a discrepancy in the step response.
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