Article

S-parameters characterization of through, blind, and buried via holes

Dept. of Electr. Eng., L'Aquila Univ., Italy
IEEE Transactions on Mobile Computing (Impact Factor: 2.91). 05/2003; 2(2):174- 184. DOI: 10.1109/TMC.2003.1217237
Source: IEEE Xplore

ABSTRACT A method for de-embedding the scattering parameters matrix for single-end or differential through, buried, and blind via holes in multilayer printed circuit boards for high-speed digital applications is presented. The proposed technique starts from a measurement or simulation of the structure containing the discontinuity and, after the structure's partitioning, extracts the scattering parameters of the required discontinuity. The procedure is applied to different kinds of single-ended and differential via holes and is validated by measurements. The finite integration technique is used to perform the needed three-dimensional electromagnetic simulations. Due to its reduced CPU time, the proposed methodology is suitable for a parametric analysis on the electrical performance of the via hole discontinuities and it gives useful results for the extraction of accurate computer-aided design models.

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