Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer

Dept. of Electr. Eng. & Comput. Sci., Korean Adv. Inst. of Sci. & Technol., Taejon, South Korea
IEEE Transactions on Advanced Packaging (Impact Factor: 1.28). 03/2003; DOI: 10.1109/TADVP.2003.811554
Source: IEEE Xplore

ABSTRACT The multiple line grid array (MLGA) interposer was recently introduced as a future high-density high-speed bonding method. In this paper, we introduce an electrical model and high-frequency characteristics of the MLGA interposer. The high-frequency electrical model was extracted from microwave S-parameter measurements up to 20 GHz as well as from fundamental microwave network analysis. For the parameter fitting process during model extraction, an optimization method was used. Several different types of MLGA interposers were designed, assembled and tested. The test vehicles contained coplanar waveguides, probing pads and an MLGA interposer structure. The height of the MLGA, the conductor shape inside the MLGA, and the dielectric insulator of the MLGA were varied. From the model, an MLGA with a height of 0.4 mm and a polymer dielectric insulator was found to have 203 pH of self inductance, 49 pH of mutual inductance with the nearest ground conductor line, and 186 fF of mutual capacitance. By reducing the height of the MLGA and by using an insulator with a lower dielectric constant, parasitic inductance and capacitance is further reduced. TDR/TDT simulation and measurement showed the validity of the extracted model parameters of the MLGA interposer. Circuit simulation based on the extracted model revealed that the MLGA interposer could be successfully used for microwave device packages up to 20 GHz and for high-speed digital device packages with a clock cycle up to 5 GHz.