Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer

Dept. of Electr. Eng. & Comput. Sci., Korean Adv. Inst. of Sci. & Technol., Taejon, South Korea
IEEE Transactions on Advanced Packaging (Impact Factor: 1.12). 03/2003; DOI: 10.1109/TADVP.2003.811554
Source: IEEE Xplore

ABSTRACT The multiple line grid array (MLGA) interposer was recently introduced as a future high-density high-speed bonding method. In this paper, we introduce an electrical model and high-frequency characteristics of the MLGA interposer. The high-frequency electrical model was extracted from microwave S-parameter measurements up to 20 GHz as well as from fundamental microwave network analysis. For the parameter fitting process during model extraction, an optimization method was used. Several different types of MLGA interposers were designed, assembled and tested. The test vehicles contained coplanar waveguides, probing pads and an MLGA interposer structure. The height of the MLGA, the conductor shape inside the MLGA, and the dielectric insulator of the MLGA were varied. From the model, an MLGA with a height of 0.4 mm and a polymer dielectric insulator was found to have 203 pH of self inductance, 49 pH of mutual inductance with the nearest ground conductor line, and 186 fF of mutual capacitance. By reducing the height of the MLGA and by using an insulator with a lower dielectric constant, parasitic inductance and capacitance is further reduced. TDR/TDT simulation and measurement showed the validity of the extracted model parameters of the MLGA interposer. Circuit simulation based on the extracted model revealed that the MLGA interposer could be successfully used for microwave device packages up to 20 GHz and for high-speed digital device packages with a clock cycle up to 5 GHz.

  • Source
    [Show abstract] [Hide abstract]
    ABSTRACT: As mobile hand-held devices including mobile phone are required to provide multi-media services more and more, it is necessary that the various hardware including high speed memory, high capacity data storage device, and high performance logic processor are integrated into the limited volume, which results in high density 3D SIP. In this work, power delivery network for 3D SIP integrated on silicon interposer will be discussed. The silicon interposer used in 3D SIP includes integrated decoupling capacitor, which gives good power delivery performance.
    Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th; 07/2007
  • [Show abstract] [Hide abstract]
    ABSTRACT: The design of a ball grid array metalized particle interconnect (BGA MPI) socket is presented. A novel design using static force system using less force and components instead of a dynamic one is shown. The performance of MPI socket has been characterized mechanically as deformation value and electrically as S parameters for different compression force. The MPI has been validated at laboratory using continuity, resistance and validation test. All of tests successfully passed which probed the socket design.
  • [Show abstract] [Hide abstract]
    ABSTRACT: The number of applications using high frequency bands up 10 GHz is in constant progression in various domains (high-speed communication, portable phone, radar...). This demand has been widely extended to connectors in automotive applications. In fact various connectors have been designed and developed in order to be used over a wide range of frequencies from a few MHz to several GHz. Among these connectors, metallized particle interconnects (MPI) used widely in interconnections (ASICs, PCs, workstations ...), constitute an interesting candidate to be developed for high frequency connectors, for frequencies up to 18 GHz. In order to simulate the connector, an MPI column was used as a terminal and compressed between two microstrip lines of copper (PCB). Signal losses measurements in the frequency band 100 MHz to 18 GHz are evaluated as a function of compression force. It was found that the impedance of the system is equivalent to an RCL circuit. By fitting experimental loss data we have analyzed each component and have established the impedance laws.
    Electrical Contacts, 2004. Proceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts; 10/2004


Available from