Article

Spread of critical currents in thin-film YBa2Cu3O7-x bicrystal junctions and faceting of grain boundary

Inst. of Radioengineering, Electron. of Russian Acad. of Sci., Moscow, Russia
IEEE Transactions on Appiled Superconductivity (impact factor: 1.04). 07/2003; DOI:10.1109/TASC.2003.813959
Source: IEEE Xplore

ABSTRACT The statistical distributions of critical currents in series arrays of YBa2Cu3O7-x grain-boundary junctions have been studied by low-temperature laser scanning microscopy. A set of arrays has been fabricated on [110] NdGaO3 bicrystal substrates with misorientation angles from 2 × 10° up to 2 × 26° and patterned to the widths from 1.7 up to 5 micrometers. The critical current values of the individual junctions in the array have been obtained by focusing a laser beam on each junction and measuring the bias current at which the maximum laser-induced voltage response has appeared on the array. The measured critical current distributions have been demonstrated to be close to a log-normal Gauss function. A spread of this distribution has been found to increase with a bicrystal angle. YBa2Cu3O7-x grain-boundary topography has been studied by atomic force microscopy. From results of these measurements we suppose that the maximum values of critical current density might be assigned to the symmetrical facets of grain boundary.

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    Article: Spread of critical currents in thin-film YBa2Cu3O7-x bicrystal junctions and faceting of grain boundary
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    ABSTRACT: This version is available at the following Publisher URL: http://ieeexplore.ieee.org/Xplore/dynhome.jsp
    IEEE Transactions on Appiled Superconductivity 02/2013; 13(2):603-605. · 1.04 Impact Factor
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    Article: Submicrometer electrical imaging of grain boundaries in high-T c thin-film junctions by laser scanning microscopy
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    ABSTRACT: High-resolution spatially resolved study of electrical inhomogeneities in high-T thin-film junctions on bicrystal c substrates has been carried out. A laser beam has been focused into a submicrometer spot on the surface of the sample and induced an increase of its local temperature. Due to bolometric or thermo-electric effects in the heated region, the change of Ž . a voltage, DV, across the junction has been developed and it has been measured as a function of the beam position x, y . Ž . The DV x, y images of YBa Cu O grain-boundary junctions made from c-axis and tilted c-axis thin films on bicrystal 2 3 7 yx Ž . substrates have been obtained. In spite of the difference in the symmetry of the bolometric and thermo-electric DV x, y images across the grain boundary, the correlation between these two images along the grain-boundary has been shown. Due Ž . to an odd symmetry of thermo-electric images DV x, y across the grain boundary, it is possible to locate the position of a grain boundary in high-T junctions with an improved resolution as low as 0.1 mm. Within this accuracy, the deviations of a c grain boundary in thin films from a bicrystal plane in the substrate have been demonstrated in grain-boundary junctions made from c-axis YBa Cu O films and the absence of this faceting has been shown for grain-boundary junctions made 2 3 7 yx from tilted c-axis films. q 1998 Elsevier Science B.V.
    Physica C Superconductivity 01/1998; 297:69-74. · 1.01 Impact Factor
  • Microstructure of an artificial grain boundary weak link in an YBaCuO thin film. J Alarco . 1993. Ultramicroscopy 51 239-246.

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Keywords

bias current
 
critical current density
 
critical current values
 
critical currents
 
individual junctions
 
log-normal Gauss function
 
low-temperature laser scanning microscopy
 
maximum laser-induced voltage response
 
measured critical current distributions
 
misorientation angles
 
NdGaO<sub>3</sub> bicrystal substrates
 
statistical distributions
 
symmetrical facets