A Two-Step Etching Technique for Silica Terraces in the PLC Hybrid Integration

Opt. Commun. Devices Res. Dept., Electron. & Telecommun. Res. Inst., Daejeon, South Korea
IEEE Photonics Technology Letters (Impact Factor: 2.11). 12/2004; 16(11):2436 - 2438. DOI: 10.1109/LPT.2004.835219
Source: IEEE Xplore


Two-step etching, after the full processes of a silica waveguide, was performed to fabricate a silica-terraced planar lightwave circuit platform for the hybrid integration of optoelectronic devices. Spot-size converted distributed feedback laser diodes (SSC DFB LDs) were flip-chip bonded on silica terraces with the height accuracy of less than 1 μm, and the resultant coupling loss between the SSC DFB LD and the silica waveguide was about 3.78 dB. The light-current curve of the LD flip-chip bonded on the platform showed the almost linear increase of the output power without any saturation.

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    • "A far-field pattern of the LDs was about 10° and 13° in horizontal and vertical directions, respectively. The alignment accuracy of the flip-chip bonding was better than ±1.5 µm, and the height alignment accuracy between the centers of the LD and PLC core was less than 1 µm [5]. Two TFFs were attached to a diced side of the V-shaped waveguides formed on the platform, and the PD carriers were assembled with the platform using the UV-curable epoxy. "
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