A two-step etching technique for silica terraces in the PLC hybrid integration
ABSTRACT Two-step etching, after the full processes of a silica waveguide, was performed to fabricate a silica-terraced planar lightwave circuit platform for the hybrid integration of optoelectronic devices. Spot-size converted distributed feedback laser diodes (SSC DFB LDs) were flip-chip bonded on silica terraces with the height accuracy of less than 1 μm, and the resultant coupling loss between the SSC DFB LD and the silica waveguide was about 3.78 dB. The light-current curve of the LD flip-chip bonded on the platform showed the almost linear increase of the output power without any saturation.
SourceAvailable from: Chul-Hee Park[Show abstract] [Hide abstract]
ABSTRACT: We have fabricated a planar lightwave circuit (PLC) hybrid-integrated optical sub-assembly of a triplexer using a thin film filter (TFF)-attached wavelength division multiplexer (WDM) and photodiode (PD) carriers. Two types of TFFs were attached to a diced side of a silica-terraced PLC platform, and the PD carriers with a mirror on which pin-PDs were bonded were assembled with the platform. A clear transmitter eye-pattern and minimum receiver sensitivity of -24.5 dBm were obtained under 1.25 Gb/s operation for digital applications, and a second-order inter-modulation distortion (IMD2) of -70 dBc was achieved for an analog receiver.Etri Journal 02/2006; 28(1):103-106. DOI:10.4218/etrij.06.0205.0068 · 0.95 Impact Factor
[Show abstract] [Hide abstract]
ABSTRACT: We present innovations in Planar Lightwave Circuits (PLCs) that make them ideally suited for use in advanced defense and aerospace applications. We discuss PLCs that contain no micro-optic components, no moving parts, pose no spark or fire hazard, are extremely small and lightweight, and are capable of transporting and processing a range of optical signals with exceptionally high performance. This PLC platform is designed for on-chip integration of active components such as lasers and detectors, along with transimpedance amplifiers and other electronics. These active components are hybridly integrated with our silica-on-silicon PLCs using fully-automated robotics and image recognition technology. This PLC approach has been successfully applied to the design and fabrication of multi-channel transceivers for aerospace applications. The chips contain hybrid DFB lasers and high-efficiency detectors, each capable of running over 10 Gb/s, with mixed digital and analog traffic multiplexed to a single optical fiber. This highlyintegrated functionality is combined onto a silicon chip smaller than 4 x 10 mm, weighing 125 degC, and more than 2,000 hours operating at 95 degC ambient air temperature. We believe that these recent advancements in planar lightwave circuits are poised to revolutionize optical communications and interconnects in the aerospace and defense industries.Proceedings of SPIE - The International Society for Optical Engineering 04/2010; DOI:10.1117/12.849954 · 0.20 Impact Factor
[Show abstract] [Hide abstract]
ABSTRACT: Very compact 4-channel 200-GHz-spacing external cavity lasers (ECLs) were fabricated by hybrid integration of reflection gratings and superluminescent laser diodes on a planar fightwave circuit chip. The fifth-order gratings as reflection gratings were formed using a conventional contact-mask photo-lithography process to achieve low-cost fabrication. The lasing wavelength of the fabricated ECLs matched the ITU grid with an accuracy of +/- 0.1 run, and optical powers were more than 0.4 mW at the injection current of 80 mA for all channels. The ECLs showed single mode operations with more than 30 dB side lobe suppression.Etri Journal 08/2007; 29(4):452-456. DOI:10.4218/etrij.07.0106.0285 · 0.95 Impact Factor