Excessive exposure to UV radiation causes acute adverse effects like sunburn and photosensitivity reactions and is involved in the induction and development of skin cancer. It has been reported that antioxidants have photoprotective effects against solar UV radiation. We investigated the effect of oral epigallocatechin gallate (EGCG), a powerful antioxidant in green tea, on the minimal erythema dose (MED) and UV-induced skin damage.
Female HWY/Slc hairless rats were fed the normal diet supplemented with 1,500 ppm EGCG for 8 weeks; then, the MED was determined and visual scores and transepidermal water loss were assessed to evaluate the severity of UV-induced skin damage.
At week 8 of the study, the use of dietary EGCG significantly increased MED. UV-radiation-induced sunburn severity and alterations in epidermal barrier function were also attenuated by the supplementation of EGCG.
Regular intake of EGCG strengthens the skin's tolerance by increasing MED and thus prevents UV-induced perturbation of epidermal barrier function and skin damage. These results suggest that EGCG is a potent candidate for systemic photoprotection.
"), a green tea-derived molecule, is a potent antioxidant that regulates the harmful effects induced by oxidative stress. Several studies have been reported to protective effects of EGCg (5) in response to UV radiation, which then result in inhibition of cutaneous photoaging (Vayalil et al., 2004; Jeon et al., 2009). In addition, a study using mice presented that EGCg (5) showed radioprotective effects against γ-radiation-induced responses, including the spleen index, haematological parameters , SOD activity, and malondialdehyde level (Guo et al., 2010). "
[Show abstract][Hide abstract] ABSTRACT: Radiotherapy, frequently used for treatment of solid tumors, carries two main obstacles including acquired radioresistance in cancer cells during radiotherapy and normal tissue injury. Phenylpropanoids, which are naturally occurring phytochemicals found in plants, have been identified as potential radiotherapeutic agents due to their anti-cancer activity and relatively safe levels of cytotoxicity. Various studies have proposed that these compounds could not only sensitize cancer cells to radiation resulting in inhibition of growth and cell death but also protect normal cells against radiation-induced damage. This review is intended to provide an overview of recent investigations on the usage of phenylpropanoids in combination with radiotherapy in cancer treatment.
Experimental and Molecular Medicine 04/2011; 43(6):323-33. DOI:10.3858/emm.2011.43.6.034 · 3.45 Impact Factor
[Show abstract][Hide abstract] ABSTRACT: New technologies of structure, materials and encapsulating process for over-coated flip-chip chip scale package (OFCSP) have been developed in this study. A MAP (matrix array package) type flip chip package with over-coating is developed by simultaneous encapsulating process which has the same universal production system as mini-BGA and doesn't need to change molding facility due to die shrink or product changed. A new 4×4 chips area array flip chip test vehicle was designed for this study. The new technology shows many advantages such as: high. electric performance, low cost, good reliability property, high throughput, thinner package, and void free during encapsulating process. Not only remarkable down-sizing, but also a new developed package are shown in this study together with miraculous property of soldering resistance. The OFCSP is developed by vacuum molding under simultaneous encapsulating process without void remain, and fine filler molding compounds for underfilling penetration well. It can pass perfectly level 1 JEDEC standard at 230°C reflowing and level 2 JEDEC standard at 260°C reflowing. It can also pass the reliability testing items including USPCT, TCT and HST after pre-condition of JEDEC level 3. Since the perfect property of soldering resistance is deeply related with package structure, encapsulant properties and process, the technology developed in this study can be applied for more advanced package such as paper-thin package, FC/WB embedded stacked package etc.
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