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360 PPI Flip-Chip Mounted Active Matrix Addressable Light Emitting Diode on Silicon (LEDoS) Micro-Displays

Journal of Display Technology (Impact Factor: 1.66). 04/2013; DOI: 10.1109/JDT.2013.2256107

ABSTRACT In this paper, we describe the design and fabrication of 360 PPI flip-chip mounted active matrix (AM) addressable light emitting diode on silicon (LEDoS) micro-displays. The LEDoS micro-displays are self-emitting devices which have higher light efficiency than liquid crystal based displays (LCDs) and longer lifetime than organic light emitting diodes (OLEDs) based displays . The LEDoS micro-displays were realized by integrating monolithic LED micro-arrays and silicon-based integrated circuit using a flip-chip bonding technique. The active matrix driving scheme was designed on the silicon to provide sufficient driving current and individual controllability of each LED pixel. Red, green, blue and Ultraviolet (UV) LEDoS micro-displays with a pixel size of 50 μm and pixel pitch of 70 μm were demonstrated. With a peripheral driving board, the LEDoS micro-display panels were programmed to show representative images and animations.

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    ABSTRACT: In this letter, we have described the design and fabrication of a novel backlight-unit (BLU)-free full-color LED based projector. The prototype used three active matrix (AM) addressable light emitting diode on silicon (LEDoS) micro-displays with peak emission wavelengths of 630nm, 535nm, and 445nm. The LEDoS micro-displays were realized by integrating monolithic micro-LED arrays and silicon-based integrated circuits using a flip-chip bonding technique. Since the LEDoS micro-displays are self-emitting, conventional BLUs used in liquid crystal displays (LCDs) were not needed. Using a trichroic prism to combine the light from the three LEDoS chips, we have produced the world's first 3-LEDoS projector. This BLU-free 3-LEDoS projector consists of much fewer optical components and has significantly higher light utilization efficiency (LUE) compared to conventional projectors.
    IEEE Photonics Technology Letters 12/2013; vol. 25(no. 23):pp.2267-2270. · 2.04 Impact Factor

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May 30, 2014