Article

Microstructure Analysis in As‐deposited and Annealed Damascene Cu Interconnects using OIM

AIP Conference Proceedings 09/2003; 683(1):499-503. DOI: 10.1063/1.1622518

ABSTRACT Microstructure variation with linewidth was studied for both as‐deposited and annealed damascene Cu interconnect lines. Ten specimens with different linewidth and pitch distances were investigated using Orientation Imaging Microscopy (OIM). The microstructures, examined both before and after annealing, displayed high percentage of Σ3 boundaries. The microstructure was characterized by measuring the mean grain size, grain size distribution, grain boundary misorientation distribution and coincident site lattice (CSL) boundary distribution. The mean grain size increased proportionally until the linewidth was equal to line depth and slowly stabilized thereafter. The role of linewidth to pitch distance ratio was identified on influencing some of the microstructural features. The grain shape was analyzed using the grain aspect ratio parameter. The strain distribution in the line was studied using image quality (IQ) parameter. © 2003 American Institute of Physics

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Available from: Jerzy A. Szpunar, Jan 21, 2014
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    ABSTRACT: Microstructure variation with trench aspect ratio has been investigated in both as-deposited and annealed damascene Cu interconnect lines using Orientation Imaging Microscopy (OIM). The microstructure was characterized by measuring mean grain size, grain size and grain boundary distribution and grain aspect ratio. Since the lines were highly twinned, the mean grain size was measured both before and after neglecting the presence of Sigma3 boundaries. The mean grain size was higher for the annealed lines compared to as-deposited lines and increased proportionally with decreasing trench aspect ratio in the annealed Cu lines with higher aspect ratio. The distribution of coincident site lattice (CSL) boundaries revealed a higher fraction of Sigma3 boundaries in all the lines; their increase upon annealing in the majority of the specimens was accompanied by a decrease of Sigma9 CSL boundaries. The fraction of CSL boundaries was higher in the lines with higher aspect ratios and increased upon annealing in most of the lines. The role of pitch distance (line spacing) in influencing the mean grain size and CSL boundary distribution was identified. Additionally the microstructure was characterized by measuring the grain boundary misorientation distribution. The grain shape was characterized by measuring the grain aspect ratio. Strain distribution in the lines was examined using the Image Quality (IQ) parameter.
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