Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate.
ABSTRACT One of the most serious issues in information industries is the bandwidth bottleneck in inter-chip interconnects. We propose a photonics-electronics convergence system to solve this issue. We fabricated a high density optical interposer to demonstrate the feasibility of the system by using silicon photonics integrated with an arrayed laser diode, an optical splitter, silicon optical modulators, germanium photodetectors, and silicon optical waveguides on a single silicon substrate. Error-free data transmission at 12.5 Gbps and a transmission density of 6.6 Tbps/cm2 were achieved with the optical interposer. We believe this technology will solve the bandwidth bottleneck problem in the future.
- SourceAvailable from: DanXia XuIEEE Journal of Selected Topics in Quantum Electronics 07/2014; 20(4):189-205. DOI:10.1109/JSTQE.2014.2299634 · 3.47 Impact Factor
- IEICE Electronics Express 01/2015; 12(1):20141084-20141084. DOI:10.1587/elex.11.20141084 · 0.39 Impact Factor
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ABSTRACT: In this paper, a new method is proposed to provide an inter- and intra-chip optical interconnect at the standard telecommunication wavelength of 1550 nm. The proposed optical interconnect consists of two optical leaky- wave nano-antennas as transmitter and receiver. The leaky-wave antennas are fed through a hybrid plasmonic waveguide with low propagation loss. Since the propagation length of plasmonic waveguides is not so long, each plasmonic waveguide is coupled to a silicon waveguide through an optical coupler. In comparison with previously proposed method of optical interconnect, the most important advantage of our method is its planar structure which makes it fully integrable with the photonic integrated circuits (PIC). The Fluguet theorem and the theory of surface plasmons are used to obtain an analytical model for design purposes, and the accuracy of the proposed method is verified by a 3-dimensional full-wave numerical analysis.SPIE Photonics Europe; 05/2014