A simple technique for determining the Seebeck coefficient of thermoelectric materials

Journal of Physics E Scientific Instruments (Impact Factor: 1.35). 11/2000; 19(11):921. DOI: 10.1088/0022-3735/19/11/008

ABSTRACT It is shown that the Seebeck coefficient of a semiconductor against copper can be determined in terms of that for a copper-constantan thermocouple by means of a rapid potentiometric measurement. Values obtained for typical samples of bismuth telluride alloy, using the apparatus that is described, are compared with those given by a conventional method and indicate that the technique is perfectly satisfactory.

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    • "The microparameters of a semiconductor and the resistivity, Seebeck coefficient, thermal conductivity and the figure of merit of a module can be evaluated by many known methods [1] [2] [3] [4] [5] [6] [7] [8] [9] [10] [11] [12]. The thermal parameters of a module can be obtained by virtue of these parameters. "
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    ABSTRACT: Precise calculation of parameters of thermoelectric modules and thermoelectric devices under operating conditions by present methods is very difficult. In this study, a new method is developed to calculate all parameters of thermoelectric modules. This new method makes it possible to determine the dynamic parameters of a real thermoelectric module operated under different working regimes. Measurement of thermoemf created by an operating module is the basis of this new method. An unloaded thermoelectric module, whose dynamic output parameters are necessary in the design of a medical helmet for the cooling of brain, has been investigated using this new method. A special device has been designed and realized to be used in these investigations.
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    ABSTRACT: In this study, a universal microcontroller test system, which is aimed to determine the dynamic parameters of thermoelectric modules, has been designed and realized using a novel test method. For the purpose of this work, the test system has been designed according to a more simplified form of the present formula set, which has been made to accept minimum variables as input to obtain more precise results. As a result, a test system, which can measure the dynamic parameters of a thermoelectric module universally by measuring only the hot side temperature, module operation voltage, module's current and thermoemf values of the module, has been produced. Also, the realized new test system has been used to measure a standard thermoelectric module (Melcor CP 1.4-127-10L) in order to verify its performance.
    International Journal of Thermal Sciences 07/2007; 46(7-46):717-725. DOI:10.1016/j.ijthermalsci.2006.10.008 · 2.56 Impact Factor
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    ABSTRACT: An experimental setup is developed for the measurement of the Seebeck coefficient of thin wires and thin films in the temperature range of 300-650 K. The setup makes use of the integral method for measuring the Seebeck voltage across the sample. Two pointed copper rods with in-built thermocouples serve as hot and cold probes as well as leads for measuring the Seebeck voltage. The setup employs localized heating and enables easy sample loading using a spring loaded mounting system and is fully automated. Test measurements are made on a constantan wire and indium tin oxide (ITO) thin film for illustration. The Seebeck voltage obtained for constantan wire is in agreement with the NIST data for copper constantan couple with an error of 1%. The calculated carrier concentration of ITO film from the Seebeck coefficient measurement is comparable with that obtained by electrical transport measurements. The error in the Seebeck coefficient is estimated to be within 3%.
    Review of Scientific Instruments 03/2008; 79(2 Pt 1):024302. DOI:10.1063/1.2869039 · 1.58 Impact Factor
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