It is shown that the Seebeck coefficient of a semiconductor against copper can be determined in terms of that for a copper-constantan thermocouple by means of a rapid potentiometric measurement. Values obtained for typical samples of bismuth telluride alloy, using the apparatus that is described, are compared with those given by a conventional method and indicate that the technique is perfectly satisfactory.
"The microparameters of a semiconductor and the resistivity, Seebeck coefficient, thermal conductivity and the figure of merit of a module can be evaluated by many known methods            . The thermal parameters of a module can be obtained by virtue of these parameters. "
[Show abstract][Hide abstract] ABSTRACT: Precise calculation of parameters of thermoelectric modules and thermoelectric devices under operating conditions by present methods is very difficult. In this study, a new method is developed to calculate all parameters of thermoelectric modules. This new method makes it possible to determine the dynamic parameters of a real thermoelectric module operated under different working regimes. Measurement of thermoemf created by an operating module is the basis of this new method. An unloaded thermoelectric module, whose dynamic output parameters are necessary in the design of a medical helmet for the cooling of brain, has been investigated using this new method. A special device has been designed and realized to be used in these investigations.
[Show abstract][Hide abstract] ABSTRACT: A universal microcontroller test system, which aims to determine the parameters of thermoelectric modules under various thermal loads, has been designed and realised using a novel test method. The test system has been designed according to a more simplified form of the present formula set, which has been made to accept minimum variables as the input in order to obtain more precise results. It measures all the parameters of a working thermoelectric module by measuring only the hot-side temperature, module operation voltage, current and thermal voltage values of the module. The new test system has been used to measure a standard thermoelectric module (Melcor CP 1.4-127-10L) in order to verify its performance. It has also been used to test the operation of an experimental medical apparatus, which is used to induce hypothermia (low body temperature) in the brains of rats using a thermoelectric module
[Show abstract][Hide abstract] ABSTRACT: In this study, a universal microcontroller test system, which is aimed to determine the dynamic parameters of thermoelectric modules, has been designed and realized using a novel test method. For the purpose of this work, the test system has been designed according to a more simplified form of the present formula set, which has been made to accept minimum variables as input to obtain more precise results. As a result, a test system, which can measure the dynamic parameters of a thermoelectric module universally by measuring only the hot side temperature, module operation voltage, module's current and thermoemf values of the module, has been produced. Also, the realized new test system has been used to measure a standard thermoelectric module (Melcor CP 1.4-127-10L) in order to verify its performance.
International Journal of Thermal Sciences 07/2007; 46(7-46):717-725. DOI:10.1016/j.ijthermalsci.2006.10.008 · 2.63 Impact Factor
Data provided are for informational purposes only. Although carefully collected, accuracy cannot be guaranteed. The impact factor represents a rough estimation of the journal's impact factor and does not reflect the actual current impact factor. Publisher conditions are provided by RoMEO. Differing provisions from the publisher's actual policy or licence agreement may be applicable.