Heat transfer enhancement using Al2O3–water nanofluid for an electronic liquid cooling system
ABSTRACT We have experimentally investigated the behaviour and heat transfer enhancement of a particular nanofluid, Al2O3 nanoparticle–water mixture, flowing inside a closed system that is destined for cooling of microprocessors or other electronic components. Experimental data, obtained for turbulent flow regime, have clearly shown that the inclusion of nanoparticles into distilled water has produced a considerable enhancement of the cooling block convective heat transfer coefficient. For a particular nanofluid with 6.8% particle volume concentration, heat transfer coefficient has been found to increase as much as 40% compared to that of the base fluid. It has also been found that an increase of particle concentration has produced a clear decrease of the heated component temperature. Experimental data have clearly shown that nanofluid with 36 nm particle diameter provides higher heat transfer coefficients than the ones of nanofluid with 47 nm particle size.
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ABSTRACT: Effects of mass concentration of titanium dioxide nanoparticles (TiO2 NPs) and cooling rate on the solidification of water-based nanofluids (NFs) were studied by differential scanning calorimetry (DSC). At a given cooling rate, the phase transition temperature, phase transition time and enthalpy of the NFs first increased and then decreased as mass concentration of TiO2 NPs increased, and the effect was more significant at low cooling rates than at high cooling rates. Mechanisms for these phenomena were analyzed.International Journal of Heat and Mass Transfer 04/2013; 59:29-34. DOI:10.1016/j.ijheatmasstransfer.2012.11.044 · 2.52 Impact Factor
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ABSTRACT: A comprehensive understanding of heat conduction between two parallel solid walls separated by liquid remains incomplete in nanometer scale. In addition, the solid/liquid interfacial thermal resistance has been an important technical issue in thermal/fluid engineering such as micro electro-mechanical systems and nano electro-mechanical systems with liquid inside. Therefore, further advancements in nanoscale physics require an advanced understanding of momentum and energy transport at solid/liquid interfaces. This study employs three-dimensional molecular dynamics (MD) simulations to investigate the thermal resistance at solid/liquid interfaces. Heat conduction between two parallel silicon walls separated by a thin film of liquid water is considered. The density distribution of liquid water is discussed with the simulation results to further understanding of the dynamic properties of water near solid surfaces. Meanwhile, temperature profiles appear discontinuous between liquid and solid temperatures due to the dissimilarity of thermal transport properties of the two materials, which validates thermal resistance (or Kapitza length) at solid/liquid interfaces. MD results also investigate the temperature dependence of the Kapitza length, demonstrating that the Kaptiza lengths fluctuate around an average value and are independent of the wall temperature at solid/liquid interfaces. Our study provides useful information for the design of thermal management or heat dissipation devices across silicon/water and silicon/argon interfaces in nanoscale.International Journal of Precision Engineering and Manufacturing 02/2014; 15(2):323-329. DOI:10.1007/s12541-014-0341-x · 1.50 Impact Factor
Chemical Engineering and Processing 10/2013; 72:103-112. DOI:10.1016/j.cep.2013.07.002 · 1.96 Impact Factor