Synthesis of high purity o-cresol formaldehyde novolac epoxy resins
ABSTRACT The content of total chlorine in o-cresol formaldehyde novolac epoxy resin (CNE), the main resin component for encapsulation
formulation, affects the reliability of semi-conductor device greatly and it is one of the major criteria used by the electronic
industry in measuring the quality of resins. A new process which synthesizes a high purity CNE with less than 300 ppm total
chlorine content has been developed. This high purity resin has provided an extended device life under the accelerated stress
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