Synthesis of high purity o-cresol formaldehyde novolac epoxy resins

Polymer Bulletin (Impact Factor: 1.33). 04/1991; 25(5):559-565. DOI: 10.1007/BF00293514

ABSTRACT The content of total chlorine in o-cresol formaldehyde novolac epoxy resin (CNE), the main resin component for encapsulation
formulation, affects the reliability of semi-conductor device greatly and it is one of the major criteria used by the electronic
industry in measuring the quality of resins. A new process which synthesizes a high purity CNE with less than 300 ppm total
chlorine content has been developed. This high purity resin has provided an extended device life under the accelerated stress
test condition.

  • Chemistry Letters - CHEM LETT. 01/2008; 37(11):1118-1119.
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    ABSTRACT: The curing reaction and kinetics of o-cresol formaldehyde epoxy resin (o-CFER) with polyhedral oligomeric silsesquioxane of N-aminoethyl-γ-amino propyl group (AEAP-POSS) were investigated by differential scanning calorimetry (DSC). The thermal, mechanical, and dielectric properties of o-CFER/AEAP-POSS nanocomposites were investigated with thermogravimetric analysis (TGA), torsional braid analysis (TBA), tensile tester, impact tester, and electric analyzer, respectively. The results show that the activation energy (E) of curing reaction is 58.08 kJ/mol, and the curing reaction well followed the Šesták-Berggren (S-B) autocatalytic model. The glass transition temperature (Tg) increases with the increase in AEAP-POSS content, and reaches the maximum, 107°C, when the molar ratio (Ns) of amino group to epoxy group is 0.5. The nanocomposites containing a higher percentage of AEAP-POSS exhibited a higher thermostability. The AEAP-POSS can effectively increase the mechanical properties of epoxy resin, and the tensile and impact strengths are 2.84 MPa and 143.25 kJ m−2, respectively, when Ns is 0.5. The dielectric constant (ε), dielectric loss factor (tan δ), volume resistivity (ρv), and surface resistivity (ρs) are 4.98, 3.11 × 10−4, 3.17 × 1012 Ω cm3, and 1.41 × 1012 Ω cm2, respectively, similarly at Ns 0.5. Copyright © 2009 John Wiley & Sons, Ltd.
    Polymers for Advanced Technologies 11/2009; 22(10):1395 - 1402. · 1.64 Impact Factor
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    ABSTRACT: The short-chain epoxy resin (SCER) was prepared direct from epichlorohydrin/bisphenol A (ECH/BPA). The resulted SCER and 4,4′-diaminodiphenyl sulfone (DDS) with various weight percent of triallyl isocyanurate/4,4′-bismaleimidophenylmethane (TAIC/BMI) were subsequently thermally coreacted to the corresponding high performance materials for high frequency application. They were characterized using potentiometry, Fourier transform infrared (FTIR), differential scanning calorimetry (DSC), thermogravimetric analyses (TGA), dielectric analyzer, and scanning electron microscope (SEM). Dynamic mechanical analysis (DMA) of polymers showed only a Tg indicating a low entropy, amorphous state and formed a conterminously linked polymer. The morphology of polymers revealed no phase separation. The formation of polymer was in good agreement with the proposed molecular structure, and has enhanced good thermal, mechanical, and electric properties. Furthermore, with lower nitrogen content was achieved UL-94 V-0 rating. No fume and toxic gas emission were observed during burning test for this system. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 2470–2480, 2006
    Journal of Applied Polymer Science 08/2006; 102(3):2470 - 2480. · 1.40 Impact Factor