The content of total chlorine in o-cresol formaldehyde novolac epoxy resin (CNE), the main resin component for encapsulation
formulation, affects the reliability of semi-conductor device greatly and it is one of the major criteria used by the electronic
industry in measuring the quality of resins. A new process which synthesizes a high purity CNE with less than 300 ppm total
chlorine content has been developed. This high purity resin has provided an extended device life under the accelerated stress
[Show abstract][Hide abstract] ABSTRACT: A reactive phosphorus-containing diol compound, bis(3-hydroxyphenyl) phenyl phosphate (BHPP), was synthesized. The compound (BHPP) was used as a reactive flame-retardant for diglycidyl ether of bisphenol-A (DGEBA). Thermal stability and the weight loss behavior of the cured polymers were studied by thermogravimetric analysis. The phosphorous-containing epoxy resin showed lower weight loss temperature and higher char yield than that of DGEBA. The high char yields and limiting oxygen index values as well as excellent UL-94 vertical burn test results of BHPP/DGEBA indicated the flame retardancy of the phosphorous-containing epoxy resins. The resulting phosphorous-containing epoxy resin exhibited better flame retardancy and higher thermal stability than the regular bromine containing flame retardant epoxy resin in encapsulation application. UL 94-VO rating could be achieved with a phosphorus content of as low as 1.5% (comparable to bromine content of 10%) in the cured resin, and no fume and toxic gas emission were observed.
European Polymer Journal 03/2000; 36(3-36):443-452. DOI:10.1016/S0014-3057(99)00091-9 · 3.01 Impact Factor
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