Article

Numerical analysis of heat transfer in a manifold microchannel heat sink with high efficient copper heat spreader

Microsystem Technologies (impact factor: 0.93). 02/2008; 14(3):389-395. DOI:10.1007/s00542-007-0455-5

ABSTRACT A manifold microchannel heat sink integrated with a high efficient copper heat spreader is presented. A series analysis of
three-dimensional fluid flow and heat transfer performance in this mirochannel heat sink and conventional structure are performed
by CFX commercial software package. The temperature difference along the flow direction in the new microchannel heat sink
is less than that of the conventional microchannel heat sink due to effect of the transverse channel arrays. The maximum heat
flux input of the new microchannel heat sink increases 75% more than the conventional structure with the flow rate of 1m/s.
The new design has better heat transfer characteristics than conventional one for the full range of flow rates considered.

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Keywords

CFX commercial software package
 
conventional microchannel heat sink
 
flow direction
 
flow rate
 
flow rates
 
manifold microchannel heat sink
 
mirochannel heat sink
 
new design
 
new microchannel heat sink
 
new microchannel heat sink increases 75%
 
series analysis
 
temperature difference
 
three-dimensional fluid flow
 
transverse channel arrays
 

Y. Wang