Article

The influence of hard-baking temperature applied for SU8 sensor layer on the sensitivity of capacitive chemical sensor

Applied Physics A (impact factor: 1.63). 04/2012; 95(3):673-680. DOI:10.1007/s00339-008-4966-4 pp.673-680

ABSTRACT SU8, the near-UV photosensitive epoxy-based polymer was used as a sensor layer in the capacitive chemical sensor, ready for
integration with a generic double-metal CMOS technology. It was observed that the response of the sensor slowly increases
with the temperature applied in hard-baking process as long as it remains below 300°C. At this temperature the response of
the sensor abruptly increases and becomes almost threefold. It was shown that fully crosslinked structure of the sensor layer
becomes opened and disordered when the sensor is hard-baked at temperatures between 300°C and 320°C, that is, still well below
the degradation temperature of the polymer. These changes in chemical structure were analyzed by Fourier-transform infrared
spectroscopy. The temperature-dependent changes of the sensor layer structure enable one to prepare a combination of capacitive
chemical sensors with good discrimination between some volatile organic compounds.

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Keywords

capacitive chemical sensor
 
chemical structure
 
crosslinked structure
 
degradation temperature
 
disordered
 
generic double-metal CMOS technology
 
good discrimination
 
hard-baking process
 
near-UV photosensitive epoxy-based polymer
 
ready
 
sensor
 
sensor layer
 
sensor layer structure
 
temperature-dependent changes
 
temperatures
 
volatile organic compounds