Conference Paper

Compliant Bonding, Alexander Coucoulas, 1970 Proceeding Electronic Components Conference, Awarded Best Paper

Conference: 1970 Proceedings 20th Electronic Components Conference


A Solid-state joining process referred to as Compliant Bonding employs a deformable or compliant media between an energy source and bond regions such as beam leaded integrated circuits (known as "The Chip") , conventional leads, and chips to metallized contact areas.