An embedded device technology based on a molded reconfigured wafer
ABSTRACT We report an innovative embedded device wafer level packaging technology based on a "molded reconfigured 200 mm wafer". Silicon dice are tested, grinded, and diced. For the set-up of the "reconfigured wafer" these bare silicon dice are placed faces down onto a carrier system. The core process of this technology is the encapsulation of silicon dice. We demonstrate that compression molding is a promising approach with respect to robust processing, topology, adhesion, and reliability properties. The "molded reconfigured wafer" is the base to apply thin-film interconnects similar to back-end of line processes
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Article: Bumpless build-up layer packaging[show abstract] [hide abstract]
ABSTRACT: Bumpless Build-Up Layer (BBUL) is a novel package developed to meet future packaging technology re-quirements. The BBUL package provides the advantages of small electrical loop inductance and reduced thermomechan-ical stresses on low dielectric constant (low-k) die materials. Furthermore, it allows for high lead count, ready integra-tion of multiple electronic and optical components [such as logic, memory, radio frequency, microelectromechanical sys-tems (MEMS), among others], and inherent scalability. In the present paper we investigate and discuss some of the pro-cess, routing, electrical, thermal, and mechanical attributes of BBUL.