Integration of tunable capacitors and bonded-wires for contactless RF switch and tunable filter
Dept. of Electr. Eng.-Electrophys., Univ. of Southern California, Los Angeles, CA, USADOI: 10.1109/SENSOR.2009.5285382 Conference: Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Source: IEEE Xplore
This paper describes a contactless RF MEMS switch, composed of two surface-micromachined tunable capacitors and two bonded-wire inductors, which can achieve a power isolation ratio of 10 dB with a capacitance variation of mere 4:1 over a narrow bandwidth near 2.4 GHz. This novel approach of using inductors eases the deflection requirement for the deformable bridge for the variable capacitor, and allows piezoelectric ZnO film to be used to deflect the capacitor bridge to vary the air gap, thus yielding a contactless RF switch.
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ABSTRACT: This paper presents the design, fabrication, and characterization of a contactless radio frequency (RF) microelectromechanical system (MEMS) switch, composed of two surface-micromachined piezoelectric tunable capacitors and two bonded-wire inductors. The measured insertion loss and power isolation of the fabricated switch are 2.2 and 10.1dB, respectively, with a capacitance variation of 4:1 over a narrow bandwidth near 2.2GHz. This novel approach of using inductors eases the deflection requirement for the deformable bridge of the variable capacitor, and allows piezoelectric ZnO film to be used to deflect the capacitor bridge to vary the air gap, thus yielding a contactless RF switch.Sensors and Actuators A Physical 01/2011; 165(1):73-78. DOI:10.1016/j.sna.2009.12.026 · 1.90 Impact Factor
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ABSTRACT: Automatic wire bonding is a highly mature, cost-efficient and broadly available back-end process, intended to create electrical interconnections in semiconductor chip packaging. Modern production wire-bonding tools can bond wires with speeds of up to 30 bonds per second with placement accuracies of better than , and the ability to form each wire individually into a desired shape. These features render wire bonding a versatile tool also for integrating wires in applications other than electrical interconnections. Wire bonding has been adapted and used to implement a variety of innovative microstructures. This paper reviews unconventional uses and applications of wire bonding that have been reported in the literature. The used wire-bonding techniques and materials are discussed, and the implemented applications are presented. They include the realization and integration of coils, transformers, inductors, antennas, electrodes, through silicon vias, plugs, liquid and vacuum seals, plastic fibers, shape memory alloy actuators, energy harvesters and sensors.Journal of Micromechanics and Microengineering 06/2013; 23(8):083001. DOI:10.1088/0960-1317/23/8/083001 · 1.73 Impact Factor
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