An Application of 3-D MEMS Packaging: Out-of-Plane Quadrupole Mass Filters

Massachusetts Inst. of Technol., Cambridge, MA
Journal of Microelectromechanical Systems (Impact Factor: 2.13). 01/2009; DOI: 10.1109/JMEMS.2008.2006769
Source: IEEE Xplore

ABSTRACT This paper reports the design, fabrication, and characterization of low-cost out-of-plane quadrupole mass filters that use commercially available dowel pins as electrode rods. The quadrupoles implement a 3-D MEMS packaging technology that relies on deep-reactive ion etching (DRIE)-patterned deflection springs for alignment. Quadrupoles with rod diameter ranging from 0.25 to 1.58 mm and aspect ratio of 30 to 60 were built and tested at RF frequencies of 1.44, 2.0, and 4 MHz. Assembled devices operated in the first stability region achieved a maximum mass range of 650 amu, while a minimum half-peak width of 0.4 amu at mass 28 was obtained in the second stability region. Operation in the second stability region provides a means to higher resolution, smoother peaks, and removed peak splitting at the expense of transmission. The ultimate resolution of the reported quadrupoles is also discussed.

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