Conference Paper

# Mode-matching analysis of substrate-integrated waveguide circuits

Dept. of Electr. & Comput. Eng., Univ. of Victoria, Victoria, BC, Canada

DOI: 10.1109/CCECE.2011.6030517 Conference: Electrical and Computer Engineering (CCECE), 2011 24th Canadian Conference on Source: IEEE Xplore

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**ABSTRACT:**The substrate integrated waveguide (SIW) comprising rectangular via-holes is herein treated by a rigorous full-wave modal analysis using the moment method entailing Green's functions for rectangular cavities and planar multilayer structures in the spectral domain. Modal dispersion graphs generated by this solution approach are compared with those obtained by an independent commercial full-wave solver. The ability of the modal solution in treating SIW junctions and discontinuities is demonstrated by the treatment of an interconnection between a conventional waveguide and a SIW using the mode-matching technique. Inhomogeneities within SIWs can also be accommodated by the technique, as showcased by a specific example of the so-called hard sidewalled SIW. Three avenues of losses, namely, dielectric, side-leakage, and conductor losses, are also investigated, thereby elucidating a tradeoff between the latter two.IEEE Transactions on Microwave Theory and Techniques 10/2014; 62(10):2214-2231. · 2.94 Impact Factor -
##### Conference Paper: Return-loss investigation of the equivalent width of substrate-integrated waveguide circuits

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**ABSTRACT:**Five different models to determine the equivalent width of substrate-integrated waveguide (SIW) circuits are investigated. The reflection coefficients between all-dielectric waveguides of equivalent width and SIW circuits are analyzed by full-wave techniques. It is found that one of the models yields consistently inferior results while the others depend on the ratio of the via-hole diameter and the center-to-center spacing of the via holes. Moreover, the influence of the substrate's permittivity with respect to the via-hole diameter and spacing is demonstrated. Recommendations are derived as to the use of respective models for different via diameters and spacings.Microwave Workshop Series on Millimeter Wave Integration Technologies (IMWS), 2011 IEEE MTT-S International; 01/2011

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