Packages With Integrated 60-GHz Aperture-Coupled Patch Antennas

IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
IEEE Transactions on Antennas and Propagation (Impact Factor: 2.18). 11/2011; 59(10):3607 - 3616. DOI: 10.1109/TAP.2011.2163760
Source: IEEE Xplore


This paper presents balanced-fed and fork-fed aperture-coupled patch antennas and 16-element arrays suitable for broadband millimeter-wave communications. The antennas are realized in a multi-layer organic package structure, to which RF integrated circuits can be integrated. To improve antenna bandwidth and radiation efficiency, an air cavity is used, resulting in a superstrate planar patch-antenna structure. Additionally, resonating apertures are used to further increase the antenna bandwidth. Measured results at 60 GHz for the antennas show good performance in terms of peak gain (about 8 dBi for a single element and 17 dBi for a 16-element array), bandwidth ( >; 10 GHz for 10-dB return loss bandwidths are achievable), and radiation efficiency (80% for single-element from simulation).

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    • "In order to provide a cost-effective packaging technology in-line with WiGig requirements in terms of antenna performance, the Antenna-in-Package is the industrial's preferred approach. MmW state-of-the-art prototypes are based on HTCC [5], LTCC [6], high-resistivity silicon [7] or organic materials [8]. In this context, a MmW HDI packaging technology using low-loss organic materials has been developed [9]. "
    IEEE International Workshop on Antenna Technology; 03/2015
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    • "Fig. 1(a) shows a trapezoidal microstrip patch antenna which is excited at its edge. This antenna is very narrow in bandwidth as no bandwidth enhancement technique is employed [20]–[23]. Fig. 1(b) shows a reflector-backed one-wavelength bowtie antenna which consists of two portions, the upper dipole arm and the lower dipole arm. The upper arm is operated as a microstrip line fed trapezoidal microstrip patch antenna which is identical to the antenna shown in Fig. 1(a). "
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    ABSTRACT: By combining a printed reflector-backed one-wave-length bowtie antenna and a printed double loop antenna, a new wideband high-gain antenna element is demonstrated. Due to its low-profile structure of $sim 0.05lambda_{0}$, it is attractive to be used in an array environment. Experimentally, a series of antenna arrays operated at 60 GHz are designed and fabricated. They achieve wide impedance bandwidths covering the 57–64 GHz unlicensed frequency band. Over this band, the measured antenna gains are ranged from 14.5–15.5 dBi, 18.3–20.1 dBi and 22.5–25.2 dBi for 4-element, 14-element and 50-element antenna arrays, respectively. The measured radiation pattern has low cross-polarization level and low back radiation. The proposed low-profile antenna and arrays are low-cost in fabrication as they are simply made on a single-layer printed circuit board.
    IEEE Transactions on Antennas and Propagation 03/2014; 62(3):1232-1237. DOI:10.1109/TAP.2013.2295832 · 2.18 Impact Factor
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    • "To overcome this drawback, antennas etched over micro-machined [3] or High-Resistivity (HR) silicon [4] have led to an improvement of the gain but are still too expensive because too many steps are necessary to the fabrication process. The Antenna-in-Package solution is addressed using LTCC in [5] which is a robust and reliable approach but still quite expensive [6]. Consequently, a more affordable solution has to be found. "
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    ABSTRACT: In this paper, we present several antennas for 60 GHz low-cost packaged modules. These antennas are fabricated using a PCB substrate and the IPD™ technology. In the first part, an antenna is etched on the Taclamplus substrate from Taconic and shows very promising performances. In the second part, a microstrip line on this substrate is directly coupled to an upper patch antenna fabricated in the IPD™ technology from ST Microelectronics. The purpose is to increase the matching bandwidth and still address a low-cost antenna-in-package solution.
    Antennas and Propagation (EUCAP), 2012 6th European Conference on; 04/2012
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