Article

Metal-semiconductor transition in NiFe2O4 nanoparticles due to reverse cationic distribution by impedance spectroscopy

EMMG, Physics Division, PINSTECH, P.O. Nilore, Islamabad, Pakistan
Journal of Applied Physics (impact factor: 2.17). 06/2011; DOI:10.1063/1.3582142 pp.093704 - 093704-8
Source: IEEE Xplore

ABSTRACT We have investigated the magnetic and electrical response of the sol-gel synthesized NiFe 2 O 4 nanoparticles. Changes in the impedance plane plots with temperature have been discussed and correlated to the microstructure of the material. Thermally activated hopping carriers between Fe3+-Fe2+ and Ni2+-Ni3+ ions have been determined for a decrease in the resistance of the sample and a change in the conduction mechanism around 318 K. The mixed spinel structure and broken exchange bonds due to small size effects are due to the canted spin structure at the surface of the nanoparticles. The magnetization is found to be influenced by the surface spin canting and anisotropy. We have established the semiconducting to metallic transition (SMT) temperature to be around 358 K in terms of localized and delocalized e g electrons along with a transition from less conductive [Fe3+–O2-–Fe3+] and [Ni2+–O2-–Ni2+] linkage to more conductive [Fe3+–Fe2+] and [Ni2+–Ni3+] linkage at the octahedral B site. A decrease in the dielectric constant with temperature has been discussed in terms of the depletion of space charge layers due to the repulsion of delocalized e g electrons from the grain boundary planes. The anomalies in tangent loss and conductivity data around 358 K are discussed in the context of the SMT.

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Keywords

canted
 
conduction mechanism
 
delocalized e g electrons
 
depletion
 
dielectric constant
 
electrical response
 
exchange bonds
 
grain boundary planes
 
impedance plane plots
 
magnetic
 
magnetization
 
metallic transition
 
microstructure
 
mixed spinel structure
 
octahedral B site
 
small size effects
 
sol-gel synthesized NiFe 2 O 4 nanoparticles
 
space charge layers
 
tangent loss
 
Thermally activated hopping carriers