Conference Proceeding

Crosstalk evaluation, suppression and modeling in 3D through-strata-via (TSV) network

12/2010; DOI:10.1109/3DIC.2010.5751477 pp.1 - 8 In proceeding of: 3D Systems Integration Conference (3DIC), 2010 IEEE International
Source: IEEE Xplore

ABSTRACT Through-strata-via (TSV) is regarded as a critical component in 3D integration that extends Moore's Law. This paper reports on TSV crosstalk performance under high speed operations using a 3D electromagnetic field solver and a SPICE simulator in both the frequency domain and time domain. Impacts of the rise time, the TSV pitch/height, the substrate resistivity and the guarding TSV termination on crosstalk noise are studied. Effects of adjacent aggressors and their switching patterns on time delay and peak noise of the victim TSV signal are evaluated. For large and dense TSV networks, crosstalk matrices of different TSV line/array arrangements are investigated at certain frequency points, detailing the coupling noise levels among these TSVs. Furthermore, the frequency dependent near-end crosstalk (NEXT) and far-end crosstalk (FEXT) are accurately modeled by SPICE tools.

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Keywords

3D integration
 
adjacent aggressors
 
certain frequency points
 
critical component
 
crosstalk noise
 
dense TSV networks
 
different TSV line/array arrangements
 
extends Moore's Law
 
far-end crosstalk
 
frequency dependent near-end crosstalk
 
guarding TSV termination
 
peak noise
 
rise time
 
SPICE tools
 
switching patterns
 
time delay
 
time domain
 
TSV crosstalk performance
 
TSV pitch/height
 
victim TSV signal
 

Zheng Xu