Conference Paper

A high density small size RF test module for high throughput multiple resource testing

ADVANTEST Corp., Gunma, Japan
DOI: 10.1109/TEST.2010.5699232 Conference: Test Conference (ITC), 2010 IEEE International
Source: IEEE Xplore

ABSTRACT This paper describes a drastically downsized RF test module with multiple resources and high throughput for RF ATE systems. The major factor in downsizing is RF circuit technology in the form of RF functional systems in package (RF-SiPs), making it possible to construct RF front-end without both RF cables and RF connectors. Besides the above downsizing, high-speed RF switching operations are also achieved. Consequently, installation of multiple resources and higher throughput for RF testing has been accomplished, resulting in reduced RF test costs.

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    ABSTRACT: This paper describes latest RF ATE (Automated Test Equipments) technologies including DUT (Device under Test) connections, calibration method as well as RF test module. A major interest of RF test is cost of test (COT). Most important respect for low COT is how achieve a number of simultaneous measurements and short test time. We realized the both respects by drastically downsized RF test module with multiple resources and high throughput. The module is installed in our RF ATE systems, and contributes for reducing COT. To improve efficiency of simultaneous measurements, RF calibration and DUT board are also very important. Major contribution for downsizing of the RF test module is RF circuit technology in form of RF functional system in package (RF-SIPs)
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