Conference Proceeding

Thermal-aware reliability analysis of nanometer designs

Adv. Micro Devices Inc., Sunnyvale, CA, USA
11/2010; DOI:10.1109/EPEPS.2010.5642793 In proceeding of: Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on
Source: IEEE Xplore

ABSTRACT Increasing current densities in deep sub-micron designs necessitate accurate power and thermal analysis to help verify compliance with chip-level reliability specifications. This paper presents a thermal-aware analysis flow that accurately captures the effects of design topology, currents, and switching constraints. This static analysis flow demonstrates the need to compute temperature at the level of interconnect metal, via resistors and device fingers, and was used to verify reliability constraints on successive iterations of nanometer-level designs.

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