Article

A Power Bus With Multiple Via Ground Surface Perturbation Lattices for Broadband Noise Isolation: Modeling and Application in RF-SiP

Dept. of Electr. of Eng., Nat. Taiwan Univ., Taipei, Taiwan
IEEE Transactions on Advanced Packaging (Impact Factor: 1.12). 09/2010; DOI: 10.1109/TADVP.2009.2036858
Source: IEEE Xplore

ABSTRACT A model and application of the power bus with multiple via ground surface perturbation lattice (MV-GSPL) is investigated in this paper. A 1-D model especially considering the multiple via effects of the MV-GSPL inside the long period coplanar electromagnetic bandgap power planes (LPC-EBG) is proposed. This model can explain the mechanism of the stopband enhancement and accurately predict the effect of multiple via on the stopband behavior. The accuracy of this model is verified both by full-wave simulation and experiments. Based on this model, a MV-GSPL power/ground pair is designed on a radio-frequency (RF) package for system-in-package (SiP) application. A test C-band LNA fabricated by the TSMC 0.18-μ m 1P6M process is packaged on the MV-GSPL substrate for noise immunity test. Both the chip-package co-simulation and experimental results show excellent power noise isolation capability of the RF-SiP package.

0 Bookmarks
 · 
80 Views
  • [Show abstract] [Hide abstract]
    ABSTRACT: The ground surface perturbation lattice (GSPL) structure is investigated to suppress power noise in the power distribution network of mixed signal circuits. In order to enhance the bandwidth of the noise suppression, the GSPL structure is implemented by using multiple vias in the mushroom-like electromagnetic bandgap structure. Under the concept of multiple vias, the lower and upper bound cutoff frequencies of the bandgap are influenced by the position of the vias. An optimum position for the vias is found to achieve maximum stopband bandwidth. In this paper, the stopband mechanism of GSPL structure is investigated and the corresponding equivalent circuit model is proposed to quickly predict the lower and upper bound cutoff frequencies. Suitable test boards are fabricated and measured to demonstrate the accuracy of the design concept. The result shows that there is a good consistency between simulated, modeled, and measured results.
    IEEE Transactions on Components, Packaging, and Manufacturing Technology 01/2012; 2(2). · 1.26 Impact Factor
  • [Show abstract] [Hide abstract]
    ABSTRACT: An interleaved electromagnetic bandgap (EBG) structure is investigated to be with a compact size and wide stopband bandwidth for suppressing power/ground noise in power distribution networks. A design concept of the interleaved EBG structure is given to improve both lower and upper bound cutoff frequencies through varying the pitch of the power and ground vias and validated by measured results. An equivalent circuit model of the 1-D EBG structure is established using transmission-line sections to precisely predict the lower and upper bound cutoff frequencies. Based on the 1-D model, a physical mechanism is found to explain why the interleaved EBG structure can reduce the size and broaden the stopband. As an example, the bandgap of the interleaved EBG structure is in the range from 1.9 to 4.54 GHz. The electrical size, which is normalized to the wavelength in the substrate, and relative bandwidth are 0.071 λgL and 139%, respectively. Unlike other works with tradeoff between size and bandwidth, the interleaved EBG structure can simultaneously achieve substantial improvements on the bandwidth of 51.1% and on the miniaturization of 61.2% compared with the conventional mushroom-like EBG structure.
    IEEE Transactions on Electromagnetic Compatibility 01/2013; 55(1):159-167. · 1.33 Impact Factor
  • [Show abstract] [Hide abstract]
    ABSTRACT: A power/ground plane pair is proposed using a novel planar electromagnetic bandgap (EBG) structure for isolating the power-to-ground noise (PGN) in high-speed circuits. Each unit cell of the novel EBG is designed by etching slots in a “C” shape on the power plane while maintaining the ground plane solid. Without cascading hybrid periodic structures, it shows an efficient mitigation of PGN within an ultra-wideband frequency range of 0.25-2.18 GHz. In this paper, the equivalent circuit model and cavity mode analysis for the novel EBG unit cell are given to quickly predict the lower and upper bound cutoff frequency, respectively. The dispersion diagram of the proposed EBG structure is validated by insertion loss measurements with ports at different locations of the unit cell for different modes. The result shows that there is a good consistency between the simulated and measured results.
    IEEE Transactions on Components, Packaging, and Manufacturing Technology 01/2013; 3(4):653-660. · 1.26 Impact Factor

Full-text

View
0 Downloads
Available from