Primary cellular/dendritic spacing selection of Al–Zn alloy during unidirectional solidification

{ "0" : "State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi'an 710072, People's Republic of China" , "2" : "68.70.+w" , "3" : "81.30.Fb" , "4" : "Unidirectional solidification" , "5" : "Cellular/dendritic growth" , "6" : "Primary spacing" , "7" : "Al–Zn alloy"}
Journal of Crystal Growth (Impact Factor: 1.69). 02/1999; 197(1-2):393-395. DOI: 10.1016/S0022-0248(98)00916-6

ABSTRACT Al–4.95 wt% Zn alloy is directionally solidified with Bridgman apparatus to investigate response of cellular/dendritic microstructures and primary spacing to the variation of growth velocity. The results show that, with increasing growth rate, there exist a transition from dendrite to cell and a wide distribution range in primary cellular/dendritic spacing. The maximum, λmax, minimum, λmin, and average primary spacing, , as functions of growth rate, V, can be given by λmax=4578V−0.697, λmin=1315.7V−0.6543, =3084.5V−0.6982, respectively. The experimental results are compared with the Hunt–Lu model, and a reasonable agreement is found.

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    ABSTRACT: Structural parameters such as grain size, dendritic and cellular spacings, segregated products, porosity and other phases are strongly influenced by the thermal behavior of the metal/mold system during solidification, imposing a close correlation between this and the resulting microstructure. Numerous unidirectional solidification studies have been carried out with the objective of characterizing cellular and dendritic spacings and most of the published work has involved solidification in steady-state heat flow conditions. The objective of this article is to determine the thermal solidification parameters affecting the cellular/dendritic transition as well as to compare theoretical models that predict cellular and primary dendritic spacings with experimental results for unsteady-state solidification. Experiments were carried out in a water cooled unidirectional solidification apparatus and dilute alloys of the Sn–Pb system have been used (Sn 1.5 wt.% Pb, Sn 2.5 wt.% Pb and Sn 5 wt.% Pb).
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