The electrochemical reduction of hydrogen peroxide on polycrystalline copper in borax buffer
ABSTRACT The electrochemical reduction of hydrogen peroxide on copper electrodes in a borax buffer has been studied. The effects of surface oxidation and chloride ions in the electrolyte have been investigated. Hydrogen peroxide can be electrochemically reduced on Cu(I) oxidized surfaces. In the absence of chloride, the reduction is catalysed by a redox cycle involving the Cu(I)/Cu(II) couple. In chloride-containing solutions, the surface oxides are dissolved and the reduction becomes more irreversible. There appears to be a change in the reduction mechanism at potentials more negative than −0.45 V.
- Journal of The Electrochemical Society - J ELECTROCHEM SOC. 01/2010; 157(1).
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ABSTRACT: The topographic response of patterned copper surfaces to chemical–mechanical polishing (CMP) was investigated using a triboelectrochemical approach. Experimental methods include using a combined system containing a tribometer and a potentiostat. Results showed that more step height reduction and lower average surface roughness were obtained via CMP in acidic than in alkaline slurry. The increased contact area between wafer, pad, and abrasives was associated with the increase in friction. It was found that pH-dependent oxide formation and removal dominate the step height reduction for both acidic and alkaline slurries. The in situ approach pinpointed interactions between mechanical stimulation, chemical reaction, and electrochemical passivation. This research is beneficial to understanding triboelectrochemistry in Cu chemical–mechanical polishing of patterned wafers, an important application in semiconductor manufacturing.Journal of Electronic Materials 42(6). · 1.64 Impact Factor
- Journal of The Electrochemical Society - J ELECTROCHEM SOC. 01/2010; 157(10).