Sensors 2012, 12, 2162-2174; doi:10.3390/s120202162
A Highly Sensitive CMOS Digital Hall Sensor for Low Magnetic
Yue Xu 1,2, Hong-Bin Pan 1,*, Shu-Zhuan He 1 and Li Li 1
1 School of Electronic Science & Engineering, Nanjing University, Nanjing 210093, China;
E-Mails: email@example.com (S.-Z.H.); firstname.lastname@example.org (L.L.)
2 College of Electronic Science & Engineering, Nanjing University of Posts and
Telecommunications, Nanjing 210003, China; E-Mail: email@example.com
* Author to whom correspondence should be addressed; E-Mail: firstname.lastname@example.org;
Tel.: +86-25-8359-4796; Fax: +86-25-8368-6455.
Received: 22 December 2011; in revised form: 20 January 2012 / Accepted: 21 January 2012 /
Published: 15 February 2012
Abstract: Integrated CMOS Hall sensors have been widely used to measure magnetic
fields. However, they are difficult to work with in a low magnetic field environment due to
their low sensitivity and large offset. This paper describes a highly sensitive digital Hall
sensor fabricated in 0.18 μm high voltage CMOS technology for low field applications.
The sensor consists of a switched cross-shaped Hall plate and a novel signal conditioner. It
effectively eliminates offset and low frequency 1/f noise by applying a dynamic quadrature
offset cancellation technique. The measured results show the optimal Hall plate achieves a
high current related sensitivity of about 310 V/AT. The whole sensor has a remarkable
ability to measure a minimum ±2 mT magnetic field and output a digital Hall signal in a
wide temperature range from −40 °C to 120 °C.
Keywords: Hall sensor; CMOS technology; dynamic offset cancellation; chopped technique
Presently, Hall magnetic field sensors are widely established for their great applications in industrial
control systems, intelligent instruments, and consumer electronic products, etc. They are used not only
for direct measurement of magnetic fields, but also for non-direct measurements, like speed or
position, etc. Hall devices can be realized in standard integrated circuit processes such as the bipolar or
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CMOS technologies. Compared to bipolar Hall devices, CMOS Hall devices exhibit the following
advantages: high reliability, small size, low cost and compatibility with other CMOS technologies [1–4].
Unfortunately, integrated CMOS Hall sensors also suffer from a lot of non-idealities [2–4]. First of all,
their magnetic field sensitivity is very low. For instance, in a linear or angular position Hall sensor, the
value of magnetic field is usually 5 mT at one cm distance from a magnet which has a magnetic field
of around 0.1 T. Under this magnetic field, the CMOS Hall device gives a weak output signal of
hundreds of micro-volts. Second, its offset is rather high. A CMOS Hall device is very vulnerable to
process fluctuation, temperature drift and package-induced stress. These negative factors induce
serious offset voltage and low frequency 1/f noise which may be large enough to obscure the Hall
signal. In addition, CMOS operational amplifiers (OP-AMPs) used for Hall signal conditioning have
poor performance in terms of offset and 1/f noise compared to bipolar OP-AMPs. For example, the
typical value of the offset of a CMOS OP-AMP is as large as ±2 mV .
Therefore, the low magnetic sensitivity and the large offset of Hall sensors limit both the minimum
value of the magnetic field that can be measured as well as the accuracy of the measurements. So far
the techniques used to reduce the offset and 1/f noise from the electronic circuits, can be mainly
divided into auto-zero (AZ), correlated double sampling (CDS) and chopper stabilization (CHS)
techniques . Compared with the AZ and CDS, the CHS technique can effectively eliminate the
offset and 1/f noise of the electronics without requiring any low-pass filtering [7–9]. It transposes the
signal to a higher frequency, where there is no low frequency 1/f noise, and then demodulates it back
to the baseband after amplification. However, the CHS technique only effectively removes the offset
and 1/f noise of the amplifiers, but it cannot satisfactorily suppress the external input offset and 1/f
noise. In order to eliminate these non-ideal factors simultaneously, a quasi-chopped technique for
dynamic offset cancellation, i.e., the so-called spinning current technique, has been widely employed
in Hall sensors [9,10].
This paper deals with a highly sensitive digital Hall sensor fabricated in 0.18 μm high voltage (HV)
CMOS technology for low magnetic field applications. A new chopper stabilized instrumental chain is
employed to perform the dynamic offset cancellation, which mainly consists of an optimal switched
Hall plate, and a novel and simple signal conditioner. In particular, the proposed signal conditioner
features a switched hysteresis comparator to replace the sample-hold circuit and Schmitt trigger of
conventional signal conditioner, which further reduces the size and cost of the proposed Hall sensor.
This paper is arranged as follows: first, the design and optimization of the CMOS horizontal Hall
plate is briefly introduced. Further, the structure of an analog front-end with the dynamic offset
cancellation is described in detail. Then, the simulation and experimental results are presented and
discussed. Finally, conclusions are drawn.
2. Cross-Shaped Hall Plate
The cross-shaped Hall plate as a horizontal Hall device has been broadly used due to its relatively
high sensitivity and low offset. The structure of the CMOS cross-shaped Hall plate is schematically
shown in Figure 1. It is fabricated in an N-well diffusion area which is built in a P-type substrate, with
four N+ doped terminals [11–13]. The 90° rotation symmetrical structure makes it well suitable for
spinning current use where the biasing and sensing terminals are periodically permutated. In order
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to reduce the 1/f noise and carrier surface losses, a shallow P+ top layer often covers the surface of the
N-well. The P+ top layer and P-type substrate are usually connected to ground. When a voltage V or
current I bias is supplied via one pair of terminals and a perpendicular magnetic field BZ is applied to
the device surface, the Hall voltage VH appears on the other pair of terminals due to the Hall effect.
Considering the geometry of a real Hall plate, VH can be expressed with the current related sensitivity
. SI is determined by the geometrical correction factor G, the Hall
mobility μH or the Hall factor rH, the doping concentration nNW of the N-well, and the effective depth of
the N-well tNW.
Equation (1) can be rewritten with the voltage related sensitivity SV:
, L and W are the finger length and finger width of the
cross-shaped Hall plate, respectively.
For a cross-shaped Hall plate, the geometrical correction factor can be calculated by :
0267 . 51
θ is the Hall angle, equal to
Figure 1. Top view of a conventional cross-shape Hall plate.
Equation (1) means that SI is inversely proportional to the carrier concentration of the N-well.
Therefore, a Hall device fabricated by a standard CMOS process has a low sensitivity due to high
N-well doping concentration. In order to improve the current related sensitivity, we select a HV CMOS
process to fabricate the Hall plate as it can provide an obviously lower N-well doping level than the
standard CMOS process, despite a relatively deep N-well depth. On the other hand, the geometrical
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correction factor should also be enhanced, which is determined by the ratio of finger length L to finger
width W in terms of Equation (3). In order to improve the voltage related sensitivity without reducing
the current related sensitivity too much, an optimal cross geometry (W/L = 2) has been reasonably
selected in the layout design.
It is well known that CMOS Hall devices seriously suffer from a large offset. One of the main
origins of offset comes from the mask-misalignment, which can be minimized by designing a Hall
device with an appropriate and symmetric layout. In fact, the masks defining the terminals and N-well
implant active layer of the Hall plate could be shifted or rotated relative to each other during
photolithography. Any misalignment between terminals mask and the N-well mask will result in an
offset, even in the absence of magnetic field. However, the smaller terminals designed within the
N-well could lead to a larger masks misalignment. In the layout design, an optimized cross-shaped
Hall plate structure is developed. Compared to the conventional Hall plate, the length of terminals
reaches a maximum allowable value in the N-well for a given technology. Thus, the effect of the
masks misalignment on the offset can be greatly reduced.
3. Front-End Signal Conditioning
The block diagram of the new chopper stabilized instrumental chain is illustrated in Figure 2. At
first, applying the spinning current technique, the output and supply terminals of Hall plate are
periodically interchanged so that the useful Hall signals are separated from the offset and 1/f noise
through input chopping modulation. Then, the modulated signals are amplified by a differential
instrumentation amplifier. After this amplification, two high-pass filters remove the unwanted offset
and 1/f noise. Finally, the output signal passing through the filters is demodulated and the digital Hall
signal is generated by a switched hysteresis comparator.
Figure 2. Block diagram of the new chopper stabilized instrumental chain.
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3.1. Switched Hall plate
Figure 3 shows the switched Hall plate in Figure 2. Since the 90° rotation symmetrical Hall plate
can be considered as a distributed resistive Wheatstone bridge from a dc point of view, the dynamic
offset cancellation can be achieved by the spinning current method [3,4]. By periodical supply and
output terminals permutation, the quadrature states are generated. One pair of complementary clocks of
100 kHz produce 0° and 90° states respectively. When CLK is high level, M2, M3, M5, and M8 turn
on. The terminal a and terminal c of the Hall plate are connected to power and ground. Then current
flows from terminal a to terminal c, and Hall signal appears between terminal b and terminal d. When
NCLK is high level, M1, M4, M6 and M7 turn on, so there is a current flowing from terminal b to
terminal d. Accordingly, a Hall signal is present between terminal c and terminal a. Thus, if the change
of the magnetic field is much slower than the clock frequency, the differential output Hall voltage VH
periodically changes its polarities with the same magnitude in the course of current spinning. On the
contrary, the differential output offset voltage VOP always keeps the same magnitude and a constant
polarity, as the same imbalance occurs in adjacent branches of the equivalent Wheatstone bridge
network. It is important to note that the offset VOA of the instrumentation amplifier becomes
indistinguishable from VOP. Consequently, a demodulation should be performed to extract the Hall
signal and eliminate the Hall offset and the instrumentation amplifier’s offset simultaneously by the
following signal conditioner at no extra cost.
Figure 3. Switched Hall plate.
3.2. Signal Conditioner
The traditional signal conditioners execute sample-and-hold (S/H) and adding functions to remove
offset without using low-pass filters [3,8]. First, the two differential outputs of the instrumentation
amplifier are sampled and hold by S/H circuits during 0° and 90° states respectively. Next, the outputs
of S/H circuits input the summing OP-AMP. Finally, the offset can be cancelled out by the summing
OP-AMP. However, this signal conditioner layout requires four completely differential S/H circuits
and a summing OP-AMP, thus it requires too large a chip size to fabricate four S/H capacitances.
Moreover, the circuit structure is much more complicated. Later, a simplified circuit configuration was