Conference Paper

Thermal coupling in ICs: Applications to the test and characterization of analogue and RF circuits.

DOI: 10.1109/IOLTS.2010.5560220 Conference: 16th IEEE International On-Line Testing Symposium (IOLTS 2010), 5-7 July, 2010, Corfu, Greece
Source: DBLP

ABSTRACT In this presentation we cover how to use low frequency or DC temperature measurements to observe figures of merit of high frequency analogue circuits.

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