Conference Paper

Simul-EMI II: An Application to Simulate Electric and Magnetic Phenomena in PCB Designs.

DOI: 10.1007/978-3-642-13022-9_49 Conference: Trends in Applied Intelligent Systems - 23rd International Conference on Industrial Engineering and Other Applications of Applied Intelligent Systems, IEA/AIE 2010, Cordoba, Spain, June 1-4, 2010, Proceedings, Part I
Source: DBLP

ABSTRACT Times Cited: 0

1 Bookmark
  • Source
    [Show abstract] [Hide abstract]
    ABSTRACT: A method is presented for full-wave modeling of vertical vias in multilayered circuits. The analysis of the interior problem is based upon the cylindrical wave expansion of the magnetic field Green's function. The multiple interaction among vertical vias is modeled by the Foldy-Lax scattering formula. Multilayered effects are included by using cascaded network of the single-layer components. The exterior problem of the via and the transmission line is analyzed using the method of moments approach. The exterior and interior problems are combined into a system of equations to facilitate the solution of a large number of vias. Using this approach, the scattering matrix of problems of several thousand vias can be calculated with moderate CPU and memory requirement. Numerical results have been obtained for different via configurations and for a large range of frequency. Also illustrated are results for common and differential mode in differential signaling with surrounding idle and shorting vias.
    IEEE Transactions on Microwave Theory and Techniques 04/2003; · 2.23 Impact Factor
  • Source
    [Show abstract] [Hide abstract]
    ABSTRACT: In this paper, physics-based computer-aided-design (CAD) models for through and buried vias in parallel-plate environments are presented based on radial transmission-line theory. The crosstalk power transferred by the TEM parallel-plate mode between vias is characterized, and extended to the treatment of vias in finite substrates by means of image theory. The presented CAD models can be combined with lumped and distributed circuit elements, as well as linear and nonlinear devices, providing an accurate and fast procedure for the global modeling of high-speed electronic circuits. The corresponding simulation time for representative single or multiple via configurations has been drastically reduced compared to full-wave simulations while maintaining comparable accuracy
    IEEE Transactions on Microwave Theory and Techniques 11/2001; · 2.23 Impact Factor
  • Source
    [Show abstract] [Hide abstract]
    ABSTRACT: A lumped-element physics-based equivalent circuit for differential vias in multilayer parallel plate environments is presented. The TEM parallel plate mode excited by differential vias is quantified by implementing the developed model in a commercial CAD tool. The corresponding CAD simulations are performed in a matter of a few seconds on an Ultra 5 SUN workstation and compare well with Time Domain Reflectometry (TDR) measurements and Finite Difference Time Domain (FDTD) simulations
    Microwave Symposium Digest, 2001 IEEE MTT-S International; 02/2001


Available from
May 31, 2014