Conference Paper

Integrated Design & Test: Conquering the Conflicting Requirements of Low-Power, Variation-Tolerance and Test Cost.

DOI: 10.1109/ATS.2011.100 Conference: Proceedings of the 20th IEEE Asian Test Symposium, ATS 2011, New Delhi, India, November 20-23, 2011
Source: DBLP

ABSTRACT Design objectives of robustness and low-power usually do not go hand in hand with the test objectives of maximum test coverage and minimum test cost. Low power robust design techniques such as dual-Vth, dual-VDD, or adaptive body biasing have negative impact on the associated test cost. Similarly, test techniques like enhanced scan have large overhead in terms of area and power. In this paper, we try to mitigate the conflicting design and test requirements using an integrated approach to design and test that utilizes the existing low power and error resilient design techniques and augments them to improve test coverage and cost. Simulation results on an example 8x8 Wallace tree multiplier in 90nm technology node show 20% reduction in operating power, 60% reduction in test power and 99% reduction in critical paths while at the same time improving the yield from 96% to 100%, compared to existing design and test methodologies. All this comes at the cost of a marginal increase in area (7.8%).

0 Followers
 · 
115 Views
  • Source
    [Show abstract] [Hide abstract]
    ABSTRACT: To extend the lower bound of power supply to ultra-low voltages (0.6 V and below), we propose a dynamic-threshold voltage MOSFET (DTMOS) built on silicon-on-insulator (SOI). The threshold voltage of DTMOS drops as the gate voltage is raised, resulting in a much higher current drive than standard MOSFET at low power supply voltages. On the other hand, V<sub>t</sub> is high at V<sub>gs</sub>=0, therefore the leakage current is low. We provide experimental results and 2-D device and mixed-mode simulations to analyze DTMOS and compare its performance with a standard MOSFET. These results verify excellent DC inverter characteristics down to V<sub>dd</sub>=0.2 V, and good ring oscillator performance down to 0.3 V for DTMOS
    Electron Devices Meeting, 1994. IEDM '94. Technical Digest., International; 01/1995
  • Source
    [Show abstract] [Hide abstract]
    ABSTRACT: Bidirectional adaptive body bias (ABB) is used to compensate for die-to-die parameter variations by applying an optimum pMOS and nMOS body bias voltage to each die which maximizes the die frequency subject to a power constraint. Measurements on a 150 nm CMOS test chip which incorporates on-chip ABB, show that ABB reduces variation in die frequency by a factor of seven, while improving the die acceptance rate. An enhancement of this technique, that compensates for within-die parameter variations as well, increases the number of dies accepted in the highest frequency bin. ABB is therefore shown to provide bin split improvement in the presence of increasing process parameter variations.
    IEEE Journal of Solid-State Circuits 12/2002; 37(11-37):1396 - 1402. DOI:10.1109/JSSC.2002.803949 · 3.11 Impact Factor
  • Source
    [Show abstract] [Hide abstract]
    ABSTRACT: Pipelined processor cores are conventionally designed to accommodate the critical paths in the critical pipeline stage(s) in a single clock cycle, to ensure correctness. Such conservative design is wasteful in many cases since critical paths are rarely exercised. Thus, configuring the pipeline to operate correctly for rarely used critical paths targets the uncommon case instead of optimizing for the common case. In this study, we describe Trifecta-an architectural technique that completes common-case, subcritical path operations in a single cycle but uses two cycles when the critical path is exercised. This increases slack for both single-and two-cycle operations and offers a unique advantage under process variation. In contrast with existing mechanisms that trade power or performance for yield, Trifecta improves the yield while preserving performance and power. We applied this technique to the critical pipeline stages of a superscalar out-of-order (OoO) and a single issue in-order processor, namely instruction issue and execute, respectively. Our experiments show that the rare two-cycle operations result in a small decrease (5% for integer and 2% for floating-point benchmarks of SPEC2000) in instructions per cycle. However, the increased delay slack causes an improvement in yield-adjusted-throughput by 20% (12.7%) for an in-order (InO) processor configuration.
    IEEE Transactions on Very Large Scale Integration (VLSI) Systems 02/2010; DOI:10.1109/TVLSI.2008.2007491 · 1.14 Impact Factor
Show more

Preview

Download
1 Download
Available from