IEEE Industrial Electronics Magazine (IEEE IND ELECTRON M )

Publisher: IEEE Industrial Electronics Society, Institute of Electrical and Electronics Engineers


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  • Other titles
    IEEE industrial electronics magazine, IEM, IEEE industrial electronics, Industrial electronics
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  • Material type
    Periodical, Internet resource
  • Document type
    Journal / Magazine / Newspaper, Internet Resource

Publisher details

Institute of Electrical and Electronics Engineers

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  • Classification
    ‚Äč green

Publications in this journal

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    ABSTRACT: The first edition of this handbook was published almost a decade ago, in 2005. It gave a fairly comprehensive picture of the specialized communication networks used in diverse application areas. Solutions and technologies proposed for and deployed in process automation and on the factory floor dominated the volume. The last ten years or so have seen the remarkable success of Ethernetbased solutions adopted and standardized for real-time applications??some safety critical. The rapid evolution of newer power electronics technologies and the development of new ones called for a new edition of this handbook. Hopefully, this edition will be useful to a broad spectrum of professionals involved in the conception, design and development, standardization, and the use of specialized communication networks. It will also have the potential to be adopted by academic instructors. The industry demand for practical knowledge of specialized communication networks, as well as hands-on exposure to the equipment, is on the rise. Academic institutions engaged in engineering education and vocational training have an important role in adequately preparing future engineering graduates to enter the profession equipped with the practical knowledge sought by the industry. The book offers a comprehensive treatment of specialized communication networks, with chapters segregated by industry sectors and application domains.
    IEEE Industrial Electronics Magazine 06/2014; 8(2):67-68.
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    IEEE Industrial Electronics Magazine 03/2014; 8(1):3-5.
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    ABSTRACT: We are all used to the possibilities made available by the Internet and information and communications technology (ICT), but only those of us who are at least in our 40s can truly appreciate the difference between the present day and the time when rapid long-distance bidirectional communication could only take place via telegraph, telephone, and telex. A similar revolution occurred in the late 1830s with the invention of the telegraph, the first electric technology to gain wide success. However, this pioneering equipment performed badly; with the conductivity of commercial copper around 40% lower than its present value and insulating material unreliable, it was a common practice to lay bare overhead lines hanging on wooden poles with glass or porcelain insulators.
    IEEE Industrial Electronics Magazine 03/2014; 8(1):53-67.
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    ABSTRACT: Model predictive control (MPC) methods for applications in power converters have received considerable attention in recent years. The idea behind MPC is to use a mathematical model of the system to predict its future behavior within a predefined time. An optimization problem that includes the control objectives, the predicted variables, and possible constraints of the system is solved, yielding the control actions to be applied.
    IEEE Industrial Electronics Magazine 01/2014; 8(1):44-52.
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    IEEE Industrial Electronics Magazine 01/2014; 8(2):3-5.
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    ABSTRACT: In the last 15 years, the global demand for power saving, efficiency, and weight, size, and cost reduction in both the consumer and the industrial fields have strongly pushed the research and advancements in electronic power systems. Today, electronic power systems cover nearly the full voltage range (from volts to megavolts) and almost the full power range, if we exclude gigawatt-rated power plants. The applications include:
    IEEE Industrial Electronics Magazine 01/2014; 8(3):28-39.
  • IEEE Industrial Electronics Magazine 01/2014; 8(3):3-5.
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    ABSTRACT: In Germany, the term ?Industrie 4.0 [1] is currently prevalent in almost every industry-related fair, conference, or call for public-funded projects. First used at the Hanover Fair in 2011, the term, raised numerous discussions, and the major question is: is it a hit or hype? Even in politics, this term is used frequently with respect to German industry, and research efforts relating to it are currently supported by ?200 million from government-funding bodies?the German Federal Ministry of Education and Research and the German Federal Ministry of Economic Affairs and Energy. The term Industrie 4.0 refers to the fourth industrial revolution and is often understood as the application of the generic concept of cyberphysical systems (CPSs) [5]?[7] to industrial production systems (cyberphysical production systems). In North America, similar ideas have been brought up under the name Industrial Internet [3], [4] by General Electric. The technical basis is very similar to Industrie 4.0, but the application is broader than industrial production and also includes, e.g., smart electrical grids. The various definitions have caused confusion rather than increasing transparency. Overambitious marketing reinforced the confusion (Industrie 4.0 is already being done). This obscures the real and sound future visions behind Industrie 4.0. This column is intended to provide easy-to-understand access to the core ideas of Industrie 4.0 and describes the basic industrial requirements that need to be fulfilled for its success.
    IEEE Industrial Electronics Magazine 01/2014; 8(2):56-58.
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    IEEE Industrial Electronics Magazine 01/2014; 8(2):64-65.
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    ABSTRACT: Presents the recipients of various IEEE Industrial Electronics Society awards.
    IEEE Industrial Electronics Magazine 01/2014; 8(1):56-62.
  • IEEE Industrial Electronics Magazine 01/2014; 8(3):2-71.
  • IEEE Industrial Electronics Magazine 01/2014; 8(3):64-64.
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    ABSTRACT: Since the introduction of the first power module by Semikron in 1975, many innovations have been made to improve the thermal, electrical, and mechanical performance of power modules. These innovations in packaging technology focus on the enhancement of the heat dissipation and thermal cycling capability of the modules. Thermal cycles, caused by varying load and environmental operating conditions, induce high mechanical stress in the interconnection layers of the power module due to the different coefficients of thermal expansion (CTE), leading to fatigue and growth of microcracks in the bonding materials. As a result, the lifetime of power modules can be severely limited in practical applications. Furthermore, to reduce the size and weight of converters, the semiconductors are being operated at higher junction temperatures. Higher temperatures are especially of great interest for use of wide-?bandgap materials, such as SiC and GaN, because these materials leverage their material characteristics, particularly at higher temperatures. To satisfy these tightened requirements, on the one hand, conventional power modules, i.e., direct bonded Cu (DBC)-based systems with bond wire contacts, have been further improved. On the other hand, alternative packaging techniques, e.g., chip embedding into printed circuit boards (PCBs) and power module packaging based on the selective laser melting (SLM) technique, have been developed, which might constitute an alternative to conventional power modules in certain applications.
    IEEE Industrial Electronics Magazine 01/2014; 8(3):6-16.