Reviews on advanced materials science (REV ADV MATER SCI)
Current impact factor: 1.29
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Reviews on Advanced Materials Science website
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Publications in this journal
The aim of this research paper is to address the futuristic construction materials. Relevant data of the developments made during the recent past are also presented. It is believed that nanotechnology is going to play an important role in the development of futuristic building materials. The innovations could be two-fold; one is the modification of classical materials and the other should cover the invention of novel materials. The primary goal of all such materials should be environment friendliness. Secondarily, they should be durable and cost effective. Thirdly, they should address the space shortage. Innovations are needed as man is also planning to colonize moon and other planets. Fourthly, they should have adequate strength to cater the natural and manmade calamities. In short, they should serve the coming generations in the best possible way, which is the sole purpose of an engineering discipline.
Futuristic building materials, environment friendliness, durable, cost effective, space shortage, Strength.
Reviews on advanced materials science 03/2015;
Cellulose has found to be one of the renewable, biodegradable and
biocompatible resources. The entire prospective of the biopolymers has not been fully
exploited due to the obstinate nature of biomass, which allows its solubility only in limited
number of common solvents and the inability to easily tailor natural polymer properties.
During last few decades, ionic liquids have been suggested as green and sustainable
solvents for not only their dissolution but also regeneration of the biomass. A detailed
account of different prospects and recent developments in this field has been summarized
Reviews on advanced materials science 11/2014; Accepted.
Reviews on advanced materials science 01/2014; 36:in press.
Polymers are perhaps the most important materials for the present era of science and
technology. They are employed in nearly every device, involving the interior of every automobile to
several biomedical applications. Their diverse properties and wide range applicability prove
them to be classified as modern materials or advance materials. In context to their great potential
and widespread applicability, the characterization of polymeric solution is rapid growing area for
the researchers and scientists. Various techniques have been employed up til now to elucidate
their various structural aspects and hidden secrets of their functional aspects. A brief review of the
techniques used to characterize polymeric solutions has been presented.
Reviews on advanced materials science 01/2014; 36:165-176.
To satisfy the ever-increasing demand for higher density (functionality) and lower power
(portability), the dimensions and operating voltages of the modern electronic devices are being
reduced frequently. This has brought new challenges both from the technology and materials
point of view. One such issue is soft error, the temporary malfunction of device caused by the
effect of radiation on the Si ICs. One such radiation is high energy alpha particle whose main
source is the solders used in the packaging. The continued scaling of complementary metal
oxide semiconductor device technologies has led to continued device shrinkage and decreases
in the operating voltage of the device transistors. Scaling has meant denser circuitry overall,
thinner silicon (e.g., silicon on insulator) in logic applications, and less charge on capacitors for
volatile memory. These trends have resulted in devices being more sensitive to soft errors since
now low energy alpha particles can flip a memory bit or alter timing in a logic circuit. Due to the
use of flip-chip joints and developments towards 3D packaging, the solder bumps have moved
very closer to the active Si devices, where even the low energy alpha ray having short range is
able to induce soft error. One of the major sources of alpha particle radiation is the solders used
for joining components in the packaging and they contain alpha emitters and there is increasing
demand of Low Alpha activity Pb-free solders. The present paper reviews the issue of soft error
in depth covering its historical background, causes and effects on electronic devices along with
mitigation efforts. The importance of low alpha solders in microelectronics packaging applications
is discussed in the light of soft-error issue.
Reviews on advanced materials science 02/2013;
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