Journal of Electronic Packaging, Transactions of the ASME

Publisher: American Society of Mechanical Engineers

Journal description

Current impact factor: 0.65

Impact Factor Rankings

2015 Impact Factor Available summer 2015
2013 / 2014 Impact Factor 0.645
2012 Impact Factor 0.934
2011 Impact Factor 0.694
2010 Impact Factor 0.564
2009 Impact Factor 0.781
2008 Impact Factor 0.827
2007 Impact Factor 0.583
2006 Impact Factor 0.487
2005 Impact Factor 0.428
2004 Impact Factor 0.383
2003 Impact Factor 0.378
2002 Impact Factor 0.33
2001 Impact Factor 0.47
2000 Impact Factor 0.359
1999 Impact Factor 0.31
1998 Impact Factor 0.345
1997 Impact Factor 0.12

Impact factor over time

Impact factor
Year

Additional details

5-year impact 0.00
Cited half-life 0.00
Immediacy index 0.00
Eigenfactor 0.00
Article influence 0.00
ISSN 1528-9044

Publisher details

American Society of Mechanical Engineers

  • Pre-print
    • Author cannot archive a pre-print version
  • Post-print
    • Author cannot archive a post-print version
  • Classification
    ​ white

Publications in this journal

  • [Show abstract] [Hide abstract]
    ABSTRACT: Computer servers can be represented by lumped thermal capacitances for the purpose of simulating server and data center transient thermal response to changes in operating conditions or equipment failures. Two parameters are needed to characterize the transient behavior of a lumped-capacitance server: its thermal capacitance and its thermal conductance, heat transfer effectiveness, or time constant. To avoid the laborious task of obtaining these parameters from measurements or estimations of the thermal characteristics of internal components of the server, a method is proposed to derive these parameters from external measurements that can be easily obtained without performing an “autopsy” on the server. In this paper, we present the mathematical formulation underlying the proposed method and describe how the parameters are to be obtained from external air-temperature measurements using the mathematical model. We then present validation test cases using experimental data from server shut-down and inlet-temperature ramp tests. The experimentally obtained parameters are implemented into a computational fluid dynamics (CFD) case study of server shutdown in which the transient server exit air temperature is computed from the lumped-capacitance parameters via a user-defined function. The results thus obtained are in excellent agreement with the experimental data.
    Journal of Electronic Packaging, Transactions of the ASME 05/2014; 136(3):031005. DOI:10.1115/1.4027092
  • [Show abstract] [Hide abstract]
    ABSTRACT: Optical noninvasive temperature measurement techniques, such as interferometry, are particularly advantageous in obtaining temperature information noninvasively from enclosed low velocity flows induced by thermal sources, as commonly arise in electronic systems. The single greatest restriction in the application of interferometry as a standard measurement methodology has been the enormous cost associated with the optical equipment required. This cost is due to the quality of the optics required, which exhibits an exponential dependence on size. Digital Moire subtraction is a technique, which removes the restriction on the use of high quality optics, thereby, enabling reasonably large fields of view. In this paper, a digital Moire subtraction interferometer configuration is presented with a 140 mm field of view. First, the ability of the interferometer to accurately measure the free convection temperature field about an isothermal horizontal cylinder is examined through a comparison with measurements from literature using classical interferometry. The technique is then applied to the thermal interaction between 2D components representing BGAs mounted on a vertical printed circuit board (PCB). Qualitative and quantitative evaluation of the interferograms show the significant influence of inplane PCB conductivity on the temperature field about the PCB. The spacing to length ratio above, which upstream components on a PCB experience enhanced cooling, is reduced from 4 to 3 for a PCB with a high effective in-plane conductivity (15 W/m K). [DOI: 10.1115/1.4002161]
    Journal of Electronic Packaging, Transactions of the ASME 09/2010; 13(3):8-17. DOI:10.1115/1.4002161
  • [Show abstract] [Hide abstract]
    ABSTRACT: Recently, silicon nitride (Si(3)N(4)) has been receiving renewed attention because of its potential use as a substrate material for packaging of silicon carbide (SiC) power devices for high temperature applications. It is an attractive material for this application because it has moderate thermal conductivity and a low coefficient of thermal expansion, which is close to that of SiC. Materials that show promise for use as a diffusion barrier on Si(3)N(4) substrate for bonding SiC devices to a Si(3)N(4) substrate are refractory metals such as titanium (Ti), molybdenum (Mo), tungsten (W), and their alloys. Tungsten carbide (WC) shows promise as a diffusion barrier for bonding these devices to copper metallization on Si(3)N(4) substrates. This paper presents the results of an investigation of a metallization stack (Si(3)N(4)/Cu/WC/Ti/Pt/Ti/Au) used to bond SiC dice to Si(3)N(4) substrates. The dice were bonded using transient liquid phase bonding. Samples were characterized using X-ray diffraction for phase identification and Auger electron spectroscopy for depth profiling of the elemental composition of the metallization stack in the as-deposited state, and immediately following annealing. The metallization remained stable following subjection to a temperature of 400 degrees C for 100 h in air.
    Journal of Electronic Packaging, Transactions of the ASME 09/2009; 131(3):034502/1-3. DOI:10.1115/1.3153582