Journal of Microelectromechanical Systems (J MICROELECTROMECH S)

Publications in this journal

• Source

  Available from: usc.edu

  Article: A modular heat-shrink-packaged check valve with high pressure shutoff

  Ronalee Lo, Ellis Meng
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  ABSTRACT: A novel check valve featuring adhesiveless packaging in heat-shrink tubing and dual regulation of in-plane flow is presented. The modular design enables simple replacement of valve components to modify valve behavior and performance. The specific design is intended for low-profile fluidic applica-tions requiring flow control, such as drug delivery devices. The heat-shrink packaging scheme is extremely robust and can with-stand > 2000 mmHg (266.6 kPa) without leakage. Three different valve geometries were investigated and evaluated with theoretical and finite-element modeling analyses. Repeated flow regulation experiments on a fully packaged, hydrated valve demonstrated flow regulation between 25 and 2000 mmHg (3.33–266.6 kPa) and leak-free closure up to 500 mmHg (66.7 kPa) of reverse pressure with no observed stiction. The valve closing time constants were also determined. [2011-0064] Index Terms—Check valve, drug delivery, dual regulation, heat-shrink tubing.
  Journal of Microelectromechanical Systems ; 20.
• Article: Modular Optoelectronic Microfluidic Backplane for Fluid Analysis Systems

  Marko Brammer, Christof Megnin, Achim Voigt, Manfred Kohl, Timo Mappes
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  ABSTRACT: We report on the development of backplane modules with integrated microvalves and optical switches enabling custommade system design of analysis systems. The backplane modules are reversibly interconnected by magnetostatic connectors and provide optical and fluidic coupling to four neighboring backplane modules and one optical sensor module, which is mounted on top. This concept allows for selectively guiding fluids and light to the sensor modules to be operated. We integrated shape memory alloy (SMA) microvalves in different designs and two kinds of optical switches, i.e., one linearly actuated assembly of optical elements and one based on an electrostatically deflectable mirror. We manufactured the modules in polymers and carried out optical and fluidic characterization. The functionality of the backplane is demonstrated by interconnecting two optical sensor modules with integrated spectrometer and photodiode color sensor, respectively. Herewith, we carried out fluorescence transmission experiments.
  Journal of Microelectromechanical Systems 03/2013; 22(2):462-470.
• Article: One-Dimensional Nanograting-Based Guided-Mode Resonance Pressure Sensor

  Steven Foland, Benjamin Swedlove, Hoang Nguyen, Jeong-Bong Lee
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  ABSTRACT: —We report the design, fabrication, and characterization of a high-resolution optical pressure sensor based on guidedmode resonance (GMR) in a titanium dioxide (TiO2) nanograting embedded in an 85-µm-thick polydimethylsiloxane (PDMS) membrane. The device presented here is capable of resolving changes in pressure as small as 200 mtorr within a PDMS channel. The embedded GMR grating has a pitch distance of 500 nm when the PDMS membrane is unstrained; at this pitch, the grating has a resonance response at around 727 nm, producing a peak in the reflectivity spectrum of the device. When pressure within the channel increases, the membrane is strained, resulting in an increase in the grating pitch as well as its corresponding resonant wavelength. By measuring the resulting change in the reflectivity spectrum of the grating, the device should be able to detect changes in relative pressure throughout a range of over 60 torr
  Journal of Microelectromechanical Systems 05/2012;
• Article: Controlled Chemical Etching of ZnO Film for Step Coverage in MEMS Acoustic Sensor

  M Prasad, RP Yadav, V Sahula, VK Khanna, C Shekhar
  Journal of Microelectromechanical Systems 01/2012; 21(3):517-519.
• Article: Investigation on Mechanically Bistable MEMS Devices for Energy Harvesting From Vibrations

  Andò B, Baglio S, L'Episcopo G, Trigona C
  Journal of Microelectromechanical Systems 01/2012;
• Article: Advances in Manufacturing of Molded Tips for Scanning Probe Microscopy

  N. Moldovan, Z. T. Dai, H. J. Zeng, J. A. Carlisle, T. D. B. Jacobs, V. Vahdat, D. S. Grierson, J. J. Liu, K. T. Turner, R. W. Carpick
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  ABSTRACT: A common method for producing sharp tips used in scanning probe microscopy (SPM) and other applications involving nanoscale tips is to deposit thin-film materials, such as metals, silicon nitride, or diamond-based films, into four-faceted pyramidal molds that are formed by anisotropic etching into a (100) silicon substrate. This well-established method is capable of producing tips with radii as small as a few nanometers. However, the shape of the tip apex is difficult to control with this method, and wedge-shaped tips that are elongated in one dimension are often obtained. This limitation arises due to the practical difficulty of having four planes intersecting at a single point. Here, a new method for producing three-sided molds for SPM tips is demonstrated through the use of etching in (311) silicon wafers. It is shown that silicon nitride and ultrananocrystalline diamond tips fabricated with this new method are wedge free and sharp (< 10 nm radius), thereby restoring tip molding as a well-controlled manufacturing process for producing ultrasharp SPM tips.
  Journal of Microelectromechanical Systems 01/2012; 21(2):431-442.
• Article: Comparison of the Stress Distribution and Fatigue Behavior of 10- and 25- -Thick Deep-Reactive-Ion-Etched Si Kilohertz Resonators

  T Straub, P -O Theillet, C Eberl, O N Pierron
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  ABSTRACT: The stress distribution and fatigue behavior of nominally identical kilohertz fatigue resonators with two different thicknesses, 10 and 25 $muhboxm$, was compared in this study. The results highlight the non-uniform 3-D stress distribution of the micron-scale notched cantilever beams that depends on the thickness. The areas corresponding to the first principal stress being within 2% of the maximum value are much smaller than the overall notch area and are a function of device thickness. It is also shown that the non-negligible influence of small, nanometer-scale geometrical variations in the dimensions of nominally identical devices on the maximum stress values can be accounted for by measuring the device's resonant frequency $(f_0)$. The observed scatter in the fatigue results of these microresonators is in part associated with the challenge in accurately calculating the local stress amplitudes. Despite that large scatter, the fatigue behavior of the 10 and 25 $muhboxm$ thick devices is similar. Particularly, the overall relative decrease rates in $_textrm0$ are well related to fatigue life {$(N_!f)$^textrm4$}$ to $^textrm10$$ cycles.$hfill$[2012-0257]
  Journal of Microelectromechanical Systems 01/2012; PP(99):1 -12.
• Article: Effects of Fast Neutrons on the Electromechanical Properties of Materials Used in Microsystems

  Petros Gkotsis, Valeriya Kilchytska, Charalampos Fragkiadakis, Paul B Kirby, J-P Raskin, Laurent A Francis
  Journal of Microelectromechanical Systems 01/2012; 21:1471-1483.
• Article: Parametric Excitation, Amplification, and Tuning of MEMS Folded-Beam Comb Drive Oscillator

  K. Khirallah
  Journal of Microelectromechanical Systems 01/2012; PP(99):1-13.
• Article: Ultrahigh-Dynamic-Range Resonant MEMS Load Cells for Micromechanical Test Frames

  K Azgin, T Akin, L Valdevit
  Journal of Microelectromechanical Systems 01/2012;
• Article: Electrothermally Actuated Silicon Carbide Tunable MEMS Resonators

  E Mastropaolo, G S Wood, I Gual, P Parmiter, R Cheung
  Journal of Microelectromechanical Systems 01/2012; 21(4):811 -821.
• Article: Wetting and Active Dewetting Processes of Hierarchically Constructed Superhydrophobic Surfaces Fully Immersed in Water

  Choongyeop Lee, Chang-Jin Kim
  Journal of Microelectromechanical Systems 01/2012; 21(3):712-720.
• Source

  Available from: umn.edu

  Article: Self-Assembly and Self-Tiling: Integrating Active Dies Across Length Scales on Flexible Substrates

  Robert J Knuesel, Sechul Park, Wei Zheng, Heiko O Jacobs
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  ABSTRACT: This paper reports on recent progress in the field of directed self-assembly, wherein discrete inorganic semiconductor device components are assembled on flexible substrates, and com-pares these results with prior work. The research aims to develop self-assembly-based chiplet assembly processes that can extend minimal die sizes and throughput beyond what is currently possi-ble with robotic pick and place methods. This manuscript concen-trates on self-assembly that is driven by the reduction of surface free energy between liquid solder-coated areas on a substrate and metal-coated contacts on semiconductor dies that act as binding sites. Scaling prior results to sub-100 micrometer-sized compo-nents has required a transition to a new self-assembly platform. Specifically, recent work has moved from a drum delivery concept to a new scheme that uses a stepwise reduction of interfacial free energy at a triple interface between oil, water, and a penetrating solder-patterned substrate to introduce components. Finally, this paper also discusses design rules to produce highly periodic "self-tiled" domains on rigid, flexible, and curved substrates. We de-scribe discrete, self-tiled, and microconcentrator-augmented solar cell modules as applications that are fault tolerant and reduce the amount of Si material used by up to a factor of 22 when compared to conventional cells. [2011-0143] Index Terms—Flexible electronics, self-assembly, semiconduc-tor device packaging, solar power generation.
  Journal of Microelectromechanical Systems 01/2012; 21.
• Article: Pushing the limits for microactuators based on electroactive polymers.

  B. Gaihre, G. Alici, G. M. Spinks, J. M. Cairney
  Journal of Microelectromechanical Systems 01/2012; 21:574.
• Article: CMOS-Based High-Density Silicon Microprobe Arrays for Electronic Depth Control in Intracortical Neural Recording

  K. Seidl, S. Herwik, T. Torfs, H.P. Neves, O. Paul, P. Ruther
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  ABSTRACT: This paper reports on a novel high-density CMOS-based silicon microprobe array for intracortical recording applications. In contrast to existing systems, CMOS multiplexing units are integrated directly on the slender, needle-like probe shafts. Single-shaft probes and four-shaft combs have been realized with 188 and 752 electrodes, respectively, with a pitch of 40 μm arranged in two columns along 4-mm-long probe shafts. Rather than performing a mechanical translation of the probe shaft relative to the brain tissue to optimize the distance between electrodes and neurons, the electrode position is adjusted by electronically switching between the different electrodes along the shaft. The paper presents the probe concept, the CMOS circuitry design, the applied post-CMOS fabrication process, and the assembled probe systems.
  Journal of Microelectromechanical Systems 01/2012;
• Article: A MEMS Micro-reed Switch with One Reed Embedded in the Silicon Substrate

  M. Tang, Y. H. Lee, R. Kumar, R. Shankar, O. Le Neel
  Journal of Microelectromechanical Systems 12/2011; 20(6):1336-1344.